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1. (WO2013010113) NON-CONTACT TRANSFER PRINTING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2013/010113 International Application No.: PCT/US2012/046744
Publication Date: 17.01.2013 International Filing Date: 13.07.2012
IPC:
B41J 29/38 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
41
PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
J
TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
29
Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
38
Drives, motors, controls, or automatic cut-off devices for the entire printing mechanism
Applicants:
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS [US/US]; 352 Henry Administration Building 506 South Wright Street Urbana, Illinois 61801, US (AllExceptUS)
ROGERS, John, A. [US/US]; US (UsOnly)
FERREIRA, Placid, M. [IN/US]; US (UsOnly)
SAEIDPOURAZAR, Reza [IR/US]; US (UsOnly)
Inventors:
ROGERS, John, A.; US
FERREIRA, Placid, M.; US
SAEIDPOURAZAR, Reza; US
Agent:
MARSHALL, Shireen, R.; Greenlee Sullivan, P.C. 4875 Pearl East Circle Suite 200 Boulder, CO 80301, US
Priority Data:
61/507,78414.07.2011US
61/594,65203.02.2012US
Title (EN) NON-CONTACT TRANSFER PRINTING
(FR) IMPRESSION PAR TRANSFERT SANS CONTACT
Abstract:
(EN) A transfer printing process that exploits the mismatch in mechanical or thermo-mechanical response at the interface of a printable micro- or nano-device and a transfer stamp to drive the release of the device from the stamp and its non-contact transfer to a receiving substrate are provided. The resulting facile, pick-and-place process is demonstrated with the assembling of 3-D microdevices and the printing of GAN light-emitting diodes onto silicon and glass substrates. High speed photography is used to provide experimental evidence of thermo-mechanically driven release.
(FR) L'invention porte sur un procédé d'impression par transfert qui exploite le décalage dans la réponse mécanique ou thermomécanique à l'interface d'un microdispositif ou nanodispositif imprimable et d'un tampon transfert pour entraîner la libération du dispositif du tampon et son transfert sans contact sur un substrat de réception. Le procédé facile de transfert par preneur-placeur résultant est démontré par l'assemblage de microdispositifs en 3 dimensions et l'impression de diodes électroluminescentes de réseau global (GAN) sur des substrats de silicium et de verre. Une photographie ultra rapide est utilisée pour fournir une preuve expérimentale de la libération entraînée de façon thermomécanique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)