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1. WO2013009081 - SUBSTRATE FOR AN OPTICAL DEVICE HAVING A ZENER DIODE

Publication Number WO/2013/009081
Publication Date 17.01.2013
International Application No. PCT/KR2012/005478
International Filing Date 11.07.2012
IPC
H01L 33/48 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
H01L 33/54 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
52Encapsulations
54having a particular shape
CPC
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
H01L 25/167
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
167comprising optoelectronic devices, e.g. LED, photodiodes
Applicants
  • 주식회사 포인트엔지니어링 POINT ENGINEERING CO., LTD. [KR]/[KR] (AllExceptUS)
  • 안범모 AHN, Bum Mo [KR]/[KR] (UsOnly)
  • 박승호 PARK, Seung Ho [KR]/[KR] (UsOnly)
Inventors
  • 안범모 AHN, Bum Mo
  • 박승호 PARK, Seung Ho
Agents
  • 특허법인 다래 DARAE IP FIRM
Priority Data
10-2011-007009414.07.2011KR
Publication Language Korean (KO)
Filing Language Korean (KO)
Designated States
Title
(EN) SUBSTRATE FOR AN OPTICAL DEVICE HAVING A ZENER DIODE
(FR) SUBSTRAT POUR DISPOSITIF OPTIQUE COMPRENANT UNE DIODE ZENER
(KO) 제너 다이오드를 갖는 광 디바이스용 기판
Abstract
(EN)
The present invention relates to a substrate for an optical device having a zener diode, in which an optical element and the zener diode are accommodated in separate cavities so as to minimize optical interference caused by the zener diode, and in which a vertical insulation layer is used such that there is no need for a patterning process for an electrode or a signal line and that time needed for wire bonding is minimized. The substrate for the optical device having the zener diode according to the present invention consists essentially of: two or more columns of substrates each having a conductive upper surface, wherein vertical insulating layers are vertically interposed therebetween so as to electrically insulate the substrates; the cavity for the optical element, made of grooves formed on the upper portions of the substrates of every two adjacent columns so as to contain the vertical insulation layers; the cavity for the zener diode, made of grooves formed on the upper portions of the substrates of every two adjacent columns to contain the vertical insulation layers; and the optical element and the zener diode which are accommodated in the cavity for the optical element and in the cavity for the zener diode, respectively, such that an electrical connection between the optical element and the zener diode is in a reverse direction.
(FR)
La présente invention concerne un substrat pour un dispositif optique comprenant une diode Zener, dans lequel un élément optique et la diode Zener sont logées dans des cavités séparées afin de réduire au minimum les interférences optiques causées par la diode Zener et dans lequel une couche verticale d'isolation est utilisée afin qu'il n'y ait pas besoin d'un processus de gravure pour une électrode ou une ligne de signal et que le temps nécessaire pour la fixation de fils soit réduit au minimum. Le substrat pour un dispositif optique comprenant une diode Zener selon la présente invention se compose essentiellement de : deux colonnes de substrats ou plus, chacune ayant une surface supérieure conductrice, dans lequel des couches verticales d'isolation sont interposées verticalement entre elles afin d'isoler électriquement les substrats ; la cavité de l'élément optique, faite de rainures formées dans les parties supérieures des substrats de colonnes adjacentes, prises deux à deux, de manière à comprendre les couches verticales d'isolation ; la cavité de la diode Zener, faite de rainures formées dans les parties supérieures des substrats de colonnes adjacentes, prises deux à deux, de manière à comprendre les couches verticales d'isolation ; et l'élément optique et la diode Zener logées dans la cavité de l'élément optique et dans la cavité de la diode Zener, respectivement, si bien qu'une connexion électrique entre l'élément optique et la diode Zener se fait dans une direction inverse.
(KO)
본 발명은 광소자와 제너 다이오드를 별도의 캐비티에 수용함으로써 제너 다이오드에 의한 광 간섭을 최소화시킬 수 있을 뿐만 아니라 수직 절연층을 사용함으로써 전극이나 신호 라인에 대한 패터닝 공정이 필요없고 와이어 본딩 공수도 최소화시킬 수 있도록 한 제너 다이오드를 갖는 광 디바이스용 기판에 관한 것이다. 본 발명의 제너 다이오드를 갖는 광 디바이스용 기판은 상면이 도전성을 가지며, 각각의 사이에 수직으로 형성된 수직 절연층이 개재되어 전기적으로 절연되어 있는 두 열 이상의 기판; 인접하는 두 열마다의 상기 기판의 상부에 상기 수직 절연층을 포함하도록 형성된 홈으로 이루어진 광소자용 캐비티; 인접하는 두 열마다의 상기 기판의 상부에 상기 수직 절연층을 포함하도록 형성된 홈으로 이루어진 제너 다이오드용 캐비티 및 상기 광소자용 캐비티와 상기 제너다이오드용 캐비티에 각각 실장되되 상호 간의 전기적인 연결 관계가 역방향으로 이루어진 광소자와 제너 다이오드를 포함하여 이루어진다.
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