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1. WO2013004414 - DISTRIBUTION PLATE IN ELECTROLYTE BATH

Publication Number WO/2013/004414
Publication Date 10.01.2013
International Application No. PCT/EP2012/058073
International Filing Date 03.05.2012
IPC
C25D 5/08 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
08Electroplating with moving electrolyte, e.g. jet electroplating
C25D 7/06 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
7Electroplating characterised by the article coated
06Wires; Strips; Foils
C25D 17/00 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
C25D 21/12 2006.01
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; JOINING WORKPIECES BY ELECTROLYSIS; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
12Process control or regulation
CPC
C25D 17/00
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
C25D 17/16
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
17Constructional parts, or assemblies thereof, of cells for electrolytic coating
16Apparatus for electrolytic coating of small objects in bulk
C25D 21/12
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
21Processes for servicing or operating cells for electrolytic coating
12Process control or regulation
C25D 5/08
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
5Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
08Electroplating with moving electrolyte e.g. jet electroplating
C25D 7/0607
CCHEMISTRY; METALLURGY
25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
7Electroplating characterised by the article coated
06Wires; Strips; Foils
0607Wires
Applicants
  • NV BEKAERT SA [BE]/[BE] (AllExceptUS)
  • MERTENS, David [BE]/[BE] (UsOnly)
  • SEYNAEVE, Dominiek [BE]/[BE] (UsOnly)
Inventors
  • MERTENS, David
  • SEYNAEVE, Dominiek
Agents
  • MESSELY, Marc
Priority Data
11173037.007.07.2011EP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) DISTRIBUTION PLATE IN ELECTROLYTE BATH
(FR) PLAQUE DISTRIBUTRICE DANS UN BAIN ÉLECTROLYTIQUE
Abstract
(EN)
An installation (20) for continuously electroplating a plurality of elongated metal elements (21, 21', 21") with another metal comprises a bath (22) of an electrolyte wherein the elongated metal elements (21, 21', 21") are travelling. The bath (22) comprises a collector space (24) positioned under the elongated metal elements (21, 21', 21") and the bath further comprises a distribution plate (26) between the collector space (24) and the elongated metal elements (21, 21', 21"). The installation (20) further comprises a pump (25) for circulating the electrolyte in the bath (22) from the collector space (24) through the distribution plate (26). The collector space (24) causes first flow losses to the flow of the electrolyte. The distribution plate (26) has a multiplicity of openings for allowing the flow of the electrolyte and these openings cause second flow losses to the flow of the electrolyte. Each of the second flow losses is at least five times greater than the first flow losses.
(FR)
L'invention porte sur une installation (20) pour l'électroplacage en continu d'une pluralité d'éléments métalliques allongés (21, 21', 21") avec un autre métal, comprenant un bain (22) d'un électrolyte dans lequel se déplacent les éléments métalliques allongés (21, 21', 21"). Le bain (22) comprend un espace collecteur (24) placé sous les éléments métalliques allongés (21, 21', 21") et le bain comprend en outre une plaque distributrice (26) entre l'espace collecteur (24) et les éléments métalliques allongés (21, 21', 21"). L'installation (20) comprend en outre une pompe (25) pour la circulation de l'électrolyte dans le bain (22) à partir de l'espace collecteur (24) et en passant dans la plaque de distribution (26). L'espace collecteur (24) provoque des premières pertes de flux au flux de l'électrolyte. La plaque distributrice (26) comprend une multitude d'ouvertures pour permettre le flux de l'électrolyte et ces ouvertures provoquent des secondes pertes de flux au flux de l'électrolyte. Chacune des secondes pertes de flux est au moins cinq fois plus grande que les premières pertes de flux.
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