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1. WO2013001171 - A METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE

Publication Number WO/2013/001171
Publication Date 03.01.2013
International Application No. PCT/FI2012/050693
International Filing Date 29.06.2012
IPC
H01L 25/04 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04the devices not having separate containers
H01L 25/16 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
16the devices being of types provided for in two or more different main groups of groups H01L27/-H01L51/139
B81C 1/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 2201/0235
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0228Inertial sensors
0235Accelerometers
B81B 2201/025
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0228Inertial sensors
025Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81B 2201/0264
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0264Pressure sensors
B81B 2201/036
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
03Microengines and actuators
036Micropumps
B81B 2207/012
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2207Microstructural systems or auxiliary parts thereof
01comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
012the micromechanical device and the control or processing electronics being separate parts in the same package
Applicants
  • MURATA ELECTRONICS OY [FI]/[FI] (AllExceptUS)
  • KUISMA, Heikki [FI]/[FI] (UsOnly)
Inventors
  • KUISMA, Heikki
Agents
  • BORENIUS & Co Oy Ab
Priority Data
2011568230.06.2011FI
2012559531.05.2012FI
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) A METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE
(FR) PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SYSTÈME EN BOÎTIER, ET DISPOSITIF À SYSTÈME EN BOÎTIER
Abstract
(EN)
A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.
(FR)
La présente invention concerne un procédé de fabrication d'un dispositif à système en boîtier, ainsi qu'un dispositif à système en boîtier. Au cours du procédé, au moins une première matrice d'espèce dotée de dimensions prédéterminées, au moins une seconde matrice d'espèce dotée de dimensions prédéterminées et au moins un autre composant du dispositif à système en boîtier est inclus dans le dispositif à système en boîtier. Au moins une matrice d'espèce parmi les première et seconde matrices d'espèce est choisie pour être redimensionnée, et un matériau est ajouté à au moins une face de la matrice choisie, de telle sorte que le matériau ajouté et la matrice choisie forment une structure de matrice redimensionnée. Une couche de connexion est formée sur la structure de matrice redimensionnée. La structure de matrice redimensionnée est dimensionnée pour permettre le montage de la matrice non choisie et du ou des autres composants en contact avec la structure de matrice redimensionnée par le biais de la couche de connexion.
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