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1. (WO2012176750) NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT OF SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/176750 International Application No.: PCT/JP2012/065567
Publication Date: 27.12.2012 International Filing Date: 19.06.2012
IPC:
G03F 7/038 (2006.01) ,C08G 59/06 (2006.01)
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
038
Macromolecular compounds which are rendered insoluble or differentially wettable
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
02
Polycondensates containing more than one epoxy group per molecule
04
of polyhydroxy compounds with epihalohydrins or precursors thereof
06
of polyhydric phenols
Applicants:
日本化薬株式会社 NIPPON KAYAKU KABUSHIKI KAISHA [JP/JP]; 東京都千代田区富士見一丁目11番2号 11-2, Fujimi 1-chome, Chiyoda-ku, Tokyo 1028172, JP (AllExceptUS)
稲垣 真也 INAGAKI Shinya [JP/JP]; JP (UsOnly)
本田 那央 HONDA Nao [JP/JP]; JP (UsOnly)
今泉 尚子 IMAIZUMI Naoko [JP/JP]; JP (UsOnly)
大西 美彩都 OONISHI Misato [JP/JP]; JP (UsOnly)
Inventors:
稲垣 真也 INAGAKI Shinya; JP
本田 那央 HONDA Nao; JP
今泉 尚子 IMAIZUMI Naoko; JP
大西 美彩都 OONISHI Misato; JP
Agent:
浅村 皓 ASAMURA Kiyoshi; 東京都品川区東品川2丁目2番24号 天王洲セントラルタワー Tennoz Central Tower, 2-2-24 Higashi-Shinagawa, Shinagawa-ku, Tokyo 1408776, JP
Priority Data:
2011-13617920.06.2011JP
Title (EN) NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT OF SAME
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE NÉGATIVE ET SON PRODUIT DURCI
(JA) ネガ型感光性樹脂組成物及びその硬化物
Abstract:
(EN) A negative photosensitive resin composition which contains (A) an epoxy resin that has two or more epoxy groups in each molecule, (B) an alkali-soluble resin and (C) a cationic photopolymerization initiator. The epoxy resin (A) is an epoxy resin that is obtained by a reaction between a phenol derivative represented by formula (1) and an epihalohydrin.
(FR) L'invention concerne une composition de résine photosensible négative qui contient (A) une résine époxy qui présente au moins deux groupes époxy dans chaque molécule, (B) une résine soluble dans les alcalins et (C) un initiateur de photopolymérisation cationique. La résine époxy (A) est une résine époxy qui est obtenue par une réaction entre un dérivé phénolique représenté par la formule (1) et une épihalohydrine.
(JA)  1分子中に2個以上のエポキシ基を有するエポキシ樹脂(A)、アルカリ可溶性樹脂(B)及び光カチオン重合開始剤(C)を含有してなる感光性樹脂組成物であって、エポキシ樹脂(A)が下記式(1)で表されるフェノール誘導体と、エピハロヒドリンとの反応によって得られるエポキシ樹脂であるネガ型感光性樹脂組成物。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN103608727US20140099581JPWO2012176750KR1020140033120