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1. (WO2012175263) HEAT-SINK DEVICE AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/175263 International Application No.: PCT/EP2012/059427
Publication Date: 27.12.2012 International Filing Date: 22.05.2012
IPC:
F21V 29/00 (2006.01) ,F21Y 101/02 (2006.01)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29
Cooling or heating arrangements
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
Y
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V104
101
Point-like light sources
02
Miniature, e.g. light emitting diodes (LED)
Applicants:
OSRAM GMBH [DE/DE]; Marcel-Breuer-Strasse 6 80807 München, DE (AllExceptUS)
CHEN, Xiaoyu [CN/CN]; CN (UsOnly)
GUI, Hui [CN/CN]; CN (UsOnly)
HU, Jin [CN/CN]; CN (UsOnly)
ZENG, Junhua [CN/CN]; CN (UsOnly)
Inventors:
CHEN, Xiaoyu; CN
GUI, Hui; CN
HU, Jin; CN
ZENG, Junhua; CN
Priority Data:
201110168535.621.06.2011CN
Title (EN) HEAT-SINK DEVICE AND MANUFACTURING METHOD THEREOF
(FR) DISPOSITIF DISSIPATEUR THERMIQUE ET PROCÉDÉ DE FABRICATION ASSOCIÉ
Abstract:
(EN) The present invention relates to a heat-sink device, which comprises a first heat-sink structure (A) in thermal contact with an object from which heat to be dissipated and a second heat-sink structure (B), wherein the first heat-sink structure (A) is composed of a plurality of first heat-sink fins (1) and the second heat-sink structure (B) is composed of a plurality of second heat-sink fins (2), wherein the first heat-sink fins (1) are inserted into cavities (3) formed in the second heat-sink fins (2). In addition, the present invention also relates to a method for manufacturing the above type of heat-sink device.
(FR) L'invention concerne un dispositif dissipateur thermique comprenant une première structure de dissipateur thermique (A) en contact thermique avec un objet dont la chaleur doit être dissipée et une deuxième structure de dissipateur thermique (B), la première structure (A) étant constituée d'une pluralité de premières ailettes de dissipation thermique (1) et la deuxième structure (B) étant constituée d'une pluralité de deuxièmes ailettes de dissipation thermique (2), les premières ailettes (1) étant insérées dans cavités (3) formées dans les deuxièmes ailettes (2). L'invention concerne également un procédé de fabrication de ce dispositif dissipateur thermique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)