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1. (WO2012175126) METHOD AND APPARATUS FOR VAPOR DEPOSITION
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/175126 International Application No.: PCT/EP2011/060469
Publication Date: 27.12.2012 International Filing Date: 22.06.2011
IPC:
C23C 14/12 (2006.01) ,C23C 14/24 (2006.01) ,H01L 51/00 (2006.01) ,C23C 14/22 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06
characterised by the coating material
12
Organic material
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
24
Vacuum evaporation
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51
Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22
characterised by the process of coating
Applicants:
AIXTRON SE [DE/DE]; Kaiserstraße 98 52134 Herzogenrath, DE (AllExceptUS)
LONG, Michael [US/DE]; DE (UsOnly)
GERSDORFF, Markus [DE/DE]; DE (UsOnly)
GOPI, Baskar Pagadala [IN/DE]; DE (UsOnly)
Inventors:
LONG, Michael; DE
GERSDORFF, Markus; DE
GOPI, Baskar Pagadala; DE
Agent:
GRUNDMANN, Dirk; Rieder & Partner Corneliusstraße 45 42329 Wuppertal, DE
Priority Data:
Title (EN) METHOD AND APPARATUS FOR VAPOR DEPOSITION
(FR) PROCÉDÉ ET APPAREIL POUR UN DÉPÔT EN PHASE VAPEUR
Abstract:
(EN) A method and apparatus for vapor deposition employing a conductive, three- dimensional, open cell, reticulated structure having a solid coating of a material that was previously vapor deposited thereon. The solid coating is vaporized to form a deposition gas. A carrier gas is flowed though the three-dimensional, open cell, reticulated structure to yield a controllable partial pressure of the deposition gas thereby forming a mixture of the carrier gas and the deposition gas. The mixture is delivered at a stable flow rate to a temperature controlled substrate. The deposition gas condenses on the surface of the temperature controlled substrate.
(FR) L'invention concerne un procédé et un appareil pour un dépôt en phase vapeur employant une structure réticulée, à cellules ouvertes, tridimensionnelle, conductrice présentant un revêtement solide en un matériau qui y a été déposé au préalable en phase vapeur. Le revêtement solide est vaporisé pour former un gaz de dépôt. Un gaz support s'écoule à travers la structure réticulée, à cellules ouvertes, tridimensionnelle pour donner une pression partielle réglable du gaz de dépôt, formant ainsi un mélange du gaz support et du gaz de dépôt. Le mélange est distribué à un débit stable sur un substrat à température régulée. Le gaz de dépôt se condense sur la surface du substrat à température régulée.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2723914CN103930588JP2014522909KR1020140041794