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1. (WO2012174384) THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/174384 International Application No.: PCT/US2012/042677
Publication Date: 20.12.2012 International Filing Date: 15.06.2012
IPC:
C09J 169/00 (2006.01) ,B23K 35/36 (2006.01) ,H05K 3/30 (2006.01) ,C08K 5/19 (2006.01)
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
J
ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
169
Adhesives based on polycarbonates; Adhesives based on derivatives of polycarbonates
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
35
Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
22
characterised by the composition or nature of the material
36
Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
30
Assembling printed circuits with electric components, e.g. with resistor
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
16
Nitrogen-containing compounds
17
Amines; Quaternary ammonium compounds
19
Quaternary ammonium compounds
Applicants:
PROMERUS LLC [US/US]; 9921 Brecksville Road Brecksville, OH 44141, US (AllExceptUS)
TSANG, W.C., Peter [GB/US]; US (UsOnly)
BELL, Andrew [GB/US]; US (UsOnly)
Inventors:
TSANG, W.C., Peter; US
BELL, Andrew; US
Agent:
BERMAN, Bernard; Promerus LLC 9921 Brecksville Road Brecksville, OH 44141, US
Priority Data:
61/497,23215.06.2011US
Title (EN) THERMALLY DECOMPOSABLE POLYMER COMPOSITIONS INCORPORATING THERMALLY ACTIVATED BASE GENERATORS
(FR) COMPOSITIONS DE POLYMÈRES THERMIQUEMENT DÉCOMPOSABLES INCORPORANT DES GÉNÉRATEURS DE BASE THERMIQUEMENT ACTIVÉS
Abstract:
(EN) Embodiments in accordance with the present invention provide sacrifical polymer compositions and methods for fabricating electronic devices using such sacrifical polymer compositions where such methods include (1) providing a tacky sacrifical polymer composition that holds components in a desired alignment to one another, (2) providing solder fluxing for effecting electrical coupling; and (3) thermal decomposition or depolymerization of the sacrificial polymer composition to provide essentially residue free surfaces.
(FR) Des modes de réalisation de la présente invention concernent des compositions de polymères et des procédés de fabrication de dispositifs électroniques utilisant de telles compositions de polymères sacrificiels. Selon l'invention, de tels procédés incluent : (1) la fourniture d'une composition de polymère sacrificiel poisseuse qui maintient les composants dans un alignement souhaité les uns par rapport aux autres ; (2) la fourniture d'un fondant de brasage pour réaliser un couplage électrique ; et (3) la décomposition thermique ou la dépolymérisation de la composition de polymère sacrificiel pour obtenir des surfaces essentiellement exemptes de résidus.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
JP2014525835