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1. (WO2012173192) CONDUCTIVE LAMINATE, TRANSPARENT CONDUCTIVE LAMINATE WITH PATTERNED WIRING, AND OPTICAL DEVICE
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/173192 International Application No.: PCT/JP2012/065253
Publication Date: 20.12.2012 International Filing Date: 14.06.2012
IPC:
H01B 5/14 (2006.01) ,B32B 9/00 (2006.01) ,B32B 15/04 (2006.01) ,C23C 14/06 (2006.01) ,C23C 14/08 (2006.01) ,G06F 3/041 (2006.01) ,H01B 13/00 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
9
Layered products essentially comprising a particular substance not covered by groups B32B11/-B32B29/137
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06
characterised by the coating material
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14
Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
06
characterised by the coating material
08
Oxides
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
F
ELECTRIC DIGITAL DATA PROCESSING
3
Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
01
Input arrangements or combined input and output arrangements for interaction between user and computer
03
Arrangements for converting the position or the displacement of a member into a coded form
041
Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13
Apparatus or processes specially adapted for manufacturing conductors or cables
Applicants:
日東電工株式会社 NITTO DENKO CORPORATION [JP/JP]; 大阪府茨木市下穂積1丁目1番2号 1-1-2,Shimohozumi,Ibaraki-shi, Osaka 5678680, JP (AllExceptUS)
藤野 望 FUJINO,Nozomi [JP/JP]; JP (UsOnly)
拝師 基希 HAISHI,Motoki [JP/JP]; JP (UsOnly)
多田 光一郎 TADA,Koichiro [JP/JP]; JP (UsOnly)
坂田 義昌 SAKATA,Yoshimasa [JP/JP]; JP (UsOnly)
Inventors:
藤野 望 FUJINO,Nozomi; JP
拝師 基希 HAISHI,Motoki; JP
多田 光一郎 TADA,Koichiro; JP
坂田 義昌 SAKATA,Yoshimasa; JP
Agent:
特許業務法人 ユニアス国際特許事務所 UNIUS PATENT ATTORNEYS OFFICE; 大阪府大阪市淀川区西中島5丁目13-9 新大阪MTビル1号館 SHIN-OSAKA MT Bldg. 1, 13-9, Nishinakajima 5-chome, Yodogawa-ku, Osaka-shi, Osaka 5320011, JP
Priority Data:
2011-13543617.06.2011JP
Title (EN) CONDUCTIVE LAMINATE, TRANSPARENT CONDUCTIVE LAMINATE WITH PATTERNED WIRING, AND OPTICAL DEVICE
(FR) STRATIFIÉ CONDUCTEUR, STRATIFIÉ CONDUCTEUR TRANSPARENT AVEC CÂBLAGE À MOTIF ET DISPOSITIF OPTIQUE
(JA) 導電性積層体、パターン配線付き透明導電性積層体、および光学デバイス
Abstract:
(EN) The purpose of the present invention is to suppress increase of the resistance of a transparent conductive film when a metal layer is removed therefrom by etching, in a conductive laminate in which the metal layer is formed on the transparent conductive layer. The conductive laminate is obtained by sequentially forming a transparent conductive thin film laminate (2), which is composed of at least two transparent conductive thin films, and a metal layer (3) in this order on at least one surface of a transparent base (1). With respect to the transparent conductive thin film laminate (2), a first transparent conductive thin film (21) that is closest to the metal layer (3) is a metal oxide layer or a complex metal oxide layer that contains a main metal and one or more impurity metals, and transparent conductive thin films (22) other than the first transparent conductive thin film are complex metal oxide layers that contain a main metal and one or more impurity metals. The above-mentioned purpose can be achieved by not having the content ratio of the impurity metals in the first transparent conductive thin film (21) to be the highest among the content ratios of the impurity metals in the transparent conductive thin films constituting the transparent conductive thin film laminate (2).
(FR) La présente invention vise à réduire l'augmentation de la résistance d'un film conducteur transparent lorsqu'une couche de métal est retirée de celui-ci par gravure, dans un stratifié conducteur dans lequel la couche de métal est formée sur le film conducteur transparent. Le stratifié conducteur est obtenu par formation séquentielle d'un stratifié (2) de films minces conducteurs transparents, qui est composé d'au moins deux films minces conducteurs transparents, et d'une couche de métal (3), dans cet ordre, sur au moins une surface d'une base transparente (1). Par rapport au stratifié (2) de films minces conducteurs transparents, un premier film mince conducteur transparent (21), qui est le plus proche de la couche métallique (3), est une couche d'oxyde de métal ou une couche d'oxyde de métal complexe qui contient un métal principal et un ou plusieurs métaux d'impureté, et des films minces conducteurs transparents (22) autres que le premier film mince conducteur transparent sont des couches d'oxyde de métal complexe qui contiennent un métal principal et un ou plusieurs métaux d'impureté. Le but mentionné ci-dessus peut être atteint par le fait que le rapport de teneur des métaux d'impureté dans le premier film mince conducteur transparent (21) n'est pas le plus élevé parmi les rapports de teneur des métaux d'impureté dans les films minces conducteurs transparents constituant le stratifié (2) de films minces conducteurs transparents.
(JA)  本発明は、透明導電層上に金属層が形成された導電性積層体において、金属層をエッチングにより除去した際の透明導電層の抵抗の上昇を抑制することを目的とする。導電性積層体は、透明基材1の少なくとも一方の面に、少なくとも2層の透明導電性薄膜からなる透明導電性薄膜積層体2および金属層3がこの順に形成されている。透明導電性薄膜積層体2において、金属層3に最近接である第一透明導電性薄膜21は、金属酸化物層または主金属と1種以上の不純物金属を含有する複合金属酸化物層であり、第一透明導電性薄膜以外の透明導電性薄膜22は、主金属と1種以上の不純物金属を含有する複合金属酸化物層である。第一透明導電性薄膜21における不純物金属の含有比が、前記透明導電性薄膜積層体2を構成する各透明導電性薄膜における不純物金属の含有比の中で最大ではないことにより、上記課題が解決される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN103608872EP2722853US20140102764KR1020140009493KR1020160005139KR1020180032695