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1. (WO2012173171) COATED FIBROUS COPPER MICROPARTICLES, AND ELECTRICALLY CONDUCTIVE COATING AGENT AND ELECTRICALLY CONDUCTIVE FILM EACH CONTAINING SAID COATED FIBROUS COPPER MICROPARTICLES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/173171 International Application No.: PCT/JP2012/065187
Publication Date: 20.12.2012 International Filing Date: 14.06.2012
IPC:
B22F 1/00 (2006.01) ,B22F 1/02 (2006.01) ,C09D 7/12 (2006.01) ,C09D 201/00 (2006.01) ,H01B 1/00 (2006.01) ,H01B 1/22 (2006.01) ,H01B 5/00 (2006.01) ,H01B 5/14 (2006.01) ,H01B 5/16 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
B PERFORMING OPERATIONS; TRANSPORTING
22
CASTING; POWDER METALLURGY
F
WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1
Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
02
comprising coating of the powder
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
7
Features of coating compositions, not provided for in group C09D5/88
12
Other additives
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
D
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
201
Coating compositions based on unspecified macromolecular compounds
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1
Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20
Conductive material dispersed in non-conductive organic material
22
the conductive material comprising metals or alloys
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
14
comprising conductive layers or films on insulating-supports
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
B
CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5
Non-insulated conductors or conductive bodies characterised by their form
16
comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
Applicants:
ユニチカ株式会社 UNITIKA LTD. [JP/JP]; 兵庫県尼崎市東本町1丁目50番地 50, Higashi-Hommachi 1-chome, Amagasaki-shi, Hyogo 6600824, JP (AllExceptUS)
山田 宗紀 YAMADA, Munenori; null (UsOnly)
繁田 朗 SHIGETA, Akira; null (UsOnly)
細田 雅弘 HOSODA, Masahiro; null (UsOnly)
越後 良彰 ECHIGO, Yoshiaki; null (UsOnly)
Inventors:
山田 宗紀 YAMADA, Munenori; null
繁田 朗 SHIGETA, Akira; null
細田 雅弘 HOSODA, Masahiro; null
越後 良彰 ECHIGO, Yoshiaki; null
Agent:
特許業務法人森本国際特許事務所 MORIMOTO INT'L PATENT OFFICE; 大阪府大阪市西区西本町1丁目4番1号オリックス本町ビル4階 ORIX HOMMACHI Bldg. 4th Floor 4-1, Nishi-Honmachi 1-chome Nishi-ku, Osaka-shi Osaka 5500005, JP
Priority Data:
2011-13234514.06.2011JP
Title (EN) COATED FIBROUS COPPER MICROPARTICLES, AND ELECTRICALLY CONDUCTIVE COATING AGENT AND ELECTRICALLY CONDUCTIVE FILM EACH CONTAINING SAID COATED FIBROUS COPPER MICROPARTICLES
(FR) MICROPARTICULES DE CUIVRE FIBREUX À REVÊTEMENT, AGENT DE REVÊTEMENT ÉLECTRO-CONDUCTEUR ET FILM ÉLECTRO-CONDUCTEUR CONTENANT CHACUN DES PARTICULES DE CUIVRE FIBREUX À REVÊTEMENT
(JA) 被覆繊維状銅微粒子、並びに該被覆繊維状銅微粒子を含む導電性コーティング剤および導電性フィルム
Abstract:
(EN) The present invention relates to coated fibrous copper microparticles, in which at least a part of each of fibrous copper microparticles is coated with a metal other than copper, said coated fibrous copper microparticles being characterized in that each of the fibrous copper microparticles has a length of 1 μm or longer and an aspect ratio of 10 or greater.
(FR) L'invention concerne des microparticules de cuivre fibreux à revêtement dans lesquelles au moins une partie chacune des microparticules de cuivre fibreux est enduite d'un métal autre que du cuivre, lesdites microparticules de cuivre fibreux à revêtement étant caractérisées en ce que chacune d'elles à une longueur de 1 μm ou plus et un rapport de forme de 10 ou plus.
(JA)  本発明は、繊維状銅微粒子の少なくとも一部が銅以外の金属で被覆された被覆繊維状銅微粒子であって、該繊維状銅微粒子の長さが1μm以上であり、かつアスペクト比が10以上であることを特徴とする被覆繊維状銅微粒子である。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
CN103547396US20140120360KR1020140020286