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1. (WO2012173053) ELECTROMAGNETIC WAVE IRRADIATION MOLDING DEVICE AND ELECTROMAGNETIC WAVE IRRADIATION MOLDING METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/173053 International Application No.: PCT/JP2012/064770
Publication Date: 20.12.2012 International Filing Date: 08.06.2012
IPC:
B29C 33/38 (2006.01) ,B29C 35/08 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
33
Moulds or cores; Details thereof or accessories therefor
38
characterised by the material or the manufacturing process
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
35
Heating, cooling or curing, e.g. crosslinking, vulcanising; Apparatus therefor
02
Heating or curing, e.g. crosslinking, vulcanising
08
by wave energy or particle radiation
Applicants:
JSR株式会社 JSR CORPORATION [JP/JP]; 東京都港区東新橋一丁目9番2号 9-2, Higashi Shinbashi 1-chome, Minato-ku, Tokyo 1058640, JP (AllExceptUS)
栗原 文夫 KURIHARA Fumio [JP/JP]; JP (UsOnly)
Inventors:
栗原 文夫 KURIHARA Fumio; JP
Agent:
特許業務法人あいち国際特許事務所 AICHI, Takahashi, Iwakura & Associates; 愛知県名古屋市中村区名駅3丁目26番19号 名駅永田ビル Meieki Nagata Building, 26-19, Meieki 3-chome, Nakamura-ku, Nagoya-shi, Aichi 4500002, JP
Priority Data:
2011-13541117.06.2011JP
Title (EN) ELECTROMAGNETIC WAVE IRRADIATION MOLDING DEVICE AND ELECTROMAGNETIC WAVE IRRADIATION MOLDING METHOD
(FR) DISPOSITIF DE MOULAGE PAR IRRADIATION PAR ONDES ÉLECTROMAGNÉTIQUES ET PROCÉDÉ DE MOULAGE PAR IRRADIATION PAR ONDES ÉLECTROMAGNÉTIQUES
(JA) 電磁波照射成形装置及び電磁波照射成形方法
Abstract:
(EN) An electromagnetic wave irradiation molding device (1) is provided with a molding die (2) made of an insulation material, and an electromagnetic wave irradiation means (4) for irradiating with specific irradiation waves (X) including a wavelength region of 0.01 to 100 m. The molding die (2) is divided into a plurality of molding die portions (2A, 2B), and a cavity (20) to which a thermoplastic resin (6) is filled to mold a molded product, is formed between the die portions (2A, 2B). A surface layer (3) having a property of absorbing the specific electromagnetic waves (X) is formed on at least a part of the inner wall surface of the cavity (20).
(FR) L'invention concerne un dispositif de moulage par irradiation par ondes électromagnétiques (1) qui comprend une filière de moulage (2) faite d'une matière isolante et un moyen de rayonnement d'ondes d'électromagnétiques (4) destiné à rayonner des ondes d'irradiation spécifiques (X) comprenant une région de longueur d'onde de 0,01 à 100 m. La filière de moulage (2) est divisée en une pluralité de parties de filière de moulage (2A, 2B) et une empreinte (20) dans laquelle une résine thermoplastique (6) est introduite pour mouler un produit moulé, est formée entre les parties de filière (2A, 2B). Une couche de surface (3) ayant une propriété d'absorption des ondes électromagnétiques spécifiques (X) est formée sur au moins une partie de la surface de paroi intérieure de l'empreinte (20).
(JA)  電磁波照射成形装置1は、絶縁性材料からなる成形型2と、0.01~100mの波長領域を含む特定電磁波Xを照射する電磁波照射手段4とを備えている。成形型2は、複数の成形型部2A,2Bに分割されており、成形型部2A,2B同士の間には、熱可塑性樹脂6を充填して成形品を成形するためのキャビティ20が形成されている。キャビティ20の内壁面の少なくとも一部には、特定電磁波Xを吸収する性能を有する表面層3が形成されている。
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
EP2722146US20140225314JPWO2012173053