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1. (WO2012171557) INTEGRATION PLATFORM INCORPORATING OPTICAL WAVEGUIDE STRUCTURES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/171557 International Application No.: PCT/EP2011/059912
Publication Date: 20.12.2012 International Filing Date: 15.06.2011
Chapter 2 Demand Filed: 15.04.2013
IPC:
G02B 6/12 (2006.01) ,G02B 6/125 (2006.01) ,H01S 5/026 (2006.01) ,G02B 6/136 (2006.01)
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10
of the optical waveguide type
12
of the integrated circuit kind
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10
of the optical waveguide type
12
of the integrated circuit kind
122
Basic optical elements, e.g. light-guiding paths
125
Bends, branchings or intersections
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
026
Monolithically integrated components, e.g. waveguides, monitoring photo-detectors or drivers
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10
of the optical waveguide type
12
of the integrated circuit kind
13
Integrated optical circuits characterised by the manufacturing method
136
by etching
Applicants:
UNIVERSIDAD PÚBLICA DE NAVARRA [ES/ES]; Campus de Arrosadia E-31006 Pamplona, ES (AllExceptUS)
FUNDACIÓN INVESTIGACIÓN Y DESARROLLO EN NANOTECNOLOGÍA (FIDENA) [ES/ES]; Campus de Arrosadia E-31006 Pamplona, ES (AllExceptUS)
GALARZA GALARZA, Marko [ES/ES]; ES (UsOnly)
GARCÍA LÓPEZ, Oscar [ES/ES]; ES (UsOnly)
Inventors:
GALARZA GALARZA, Marko; ES
GARCÍA LÓPEZ, Oscar; ES
Agent:
CARPINTERO LOPEZ, Francisco; C/ Alcala, 35 E-28014 Madrid, ES
Priority Data:
Title (EN) INTEGRATION PLATFORM INCORPORATING OPTICAL WAVEGUIDE STRUCTURES
(FR) PLATEFORME D'INTÉGRATION COMPRENANT DES STRUCTURES DE GUIDES D'ONDES OPTIQUES
Abstract:
(EN) An integration platform for photonic integrated circuits comprising a first down core and a second upper core surrounded with cladding material, wherein the two cores are optically coupled, the platform comprising, in the direction of the light's propagation, a first rib waveguide etched in the down core, at least a vertical resonator, a second rib waveguide etched in the lower core and a third rib waveguide etched in the upper core and placed over the second waveguide having a constant and smaller width than the second waveguide. With this simple, flexible and cost-effective integration scheme, transference of optical power between active and passive components can be made without the need of any tapered structure such that the footprint size of the PIC can be remarkably reduced.
(FR) La présente invention concerne une plateforme d'intégration destinée à des circuits intégrés photoniques comprenant un premier cœur, inférieur, et un second cœur, supérieur, entourés d'un matériau de revêtement, ces deux cœurs étant optiquement couplés. Cette plateforme comprend, dans le sens de propagation de la lumière, un premier guide d'onde à rebord qui est gravé dans le cœur inférieur, au moins un résonateur vertical, un deuxième guide d'onde à rebord qui est gravé dans le cœur inférieur, et un troisième guide d'onde à rebord qui est gravé dans le cœur supérieur, placé au-dessus du deuxième guide d'onde, et présentant une largeur constante et inférieure à celle du deuxième guide d'onde. Cette logique d'intégration simple, souple, et relativement bon marché, permet de réaliser un transfert d'énergie optique entre composants actifs et passifs, sans nécessité de recourir à une structure conique, ce qui permet de réduire de façon notable l'encombrement de l'empreinte du circuit intégré photonique.
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)