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1. (WO2012165598) LAMINATED MODULE AND INTERPOSER USED IN SAME
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/165598 International Application No.: PCT/JP2012/064222
Publication Date: 06.12.2012 International Filing Date: 31.05.2012
IPC:
H01L 23/467 (2006.01) ,H01L 23/12 (2006.01) ,H01L 25/065 (2006.01) ,H01L 25/07 (2006.01) ,H01L 25/18 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
34
Arrangements for cooling, heating, ventilating or temperature compensation
46
involving the transfer of heat by flowing fluids
467
by flowing gases, e.g. air
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
065
the devices being of a type provided for in group H01L27/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
03
all the devices being of a type provided for in the same subgroup of groups H01L27/-H01L51/128
04
the devices not having separate containers
07
the devices being of a type provided for in group H01L29/78
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25
Assemblies consisting of a plurality of individual semiconductor or other solid state devices
18
the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/-H01L51/160
Applicants:
株式会社ザイキューブ ZyCube Co., Ltd. [JP/JP]; 神奈川県横浜市緑区長津田町4259番地3 4259-3, Nagatsuta-cho, Midori-ku, Yokohama-shi, Kanagawa 2268510, JP (AllExceptUS)
中村 博文 NAKAMURA, Hirofumi [JP/JP]; JP (UsOnly)
盆子原 學 BONKOHARA, Manabu [JP/JP]; JP (UsOnly)
Inventors:
中村 博文 NAKAMURA, Hirofumi; JP
盆子原 學 BONKOHARA, Manabu; JP
Agent:
泉 克文 IZUMI, Katsufumi; 東京都港区虎ノ門1丁目20番6号 菅沼ビル2階 2nd Floor, Suganuma Bldg., 20-6, Toranomon 1-chome, Minato-ku, Tokyo 1050001, JP
Priority Data:
2011-12293231.05.2011JP
Title (EN) LAMINATED MODULE AND INTERPOSER USED IN SAME
(FR) MODULE STRATIFIÉ ET ÉLÉMENT D'INTERPOSITION UTILISÉ DANS CELUI-CI
(JA) 積層モジュール及びそれに用いるインターポーザ
Abstract:
(EN) Provided is a laminated module that can suppress a temperature rise accompanying the heat release of semiconductor devices, allowing stable operation, even in the case of a configuration laminating semiconductor devices having a large power consumption. The laminated module is provided with: an interposer (70) having a channel (71) through which a fluid flows; at least one first semiconductor device disposed on one side of the interposer (70); and at least one second semiconductor device disposed at the reverse surface of the interposer (70) from the first semiconductor device. The channel (71) of the interposer (70) has a first region having a cross-sectional area that is relatively smaller and a second region having a cross-sectional area that is relatively larger, and is configured in a manner so that the fluid is subjected to adiabatic expansion partway along moving from the first region to the second region.
(FR) L'invention concerne un module stratifié qui peut supprimer une élévation de température accompagnant le dégagement de chaleur de dispositifs à semi-conducteurs, permettant un fonctionnement stable, même dans le cas d'une configuration à stratification de dispositifs à semi-conducteurs ayant une forte consommation d'énergie. Le module stratifié comporte : un élément d'interposition (70) ayant un canal (71) à travers lequel s'écoule un fluide ; au moins un premier dispositif à semi-conducteurs disposé d'un côté de l'élément d'interposition (70) ; et au moins un second dispositif à semi-conducteurs disposé sur la surface opposée de l'élément d'interposition (70) par rapport au premier dispositif à semi-conducteurs. Le canal (71) de l'élément d'interposition (70) comporte une première région ayant une section transversale qui est relativement plus petite et une seconde région ayant une section transversale qui est relativement plus grande, et est configurée de telle manière que le fluide est soumis à une détente adiabatique à mi-chemin le long de son déplacement de la première région à la seconde région.
(JA)  消費電力の大きい半導体デバイスを積層した構成を持つ場合であっても、それら半導体デバイスの発熱に伴う温度上昇を抑えて安定に動作させることができる積層モジュールを提供する。 積層モジュールは、流体が流れるチャネル71を持つインターポーザ70と、インターポーザ70の片側に配置された1個以上の第1半導体デバイスと、インターポーザ70の第1半導体デバイスとは反対側に配置された1個以上の第2半導体デバイスとを備える。インターポーザ70のチャネル71は、断面積が相対的に小さい第1領域と、断面積が相対的に小大きい第2領域とを有していると共に、前記第1領域から前記第2領域へ移動する途中で流体が断熱膨張を引き起こすように構成されている。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)