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1. WO2012133080 - CURABLE SILICONE RESIN COMPOSITION AND CURED SILICONE RESIN

Publication Number WO/2012/133080
Publication Date 04.10.2012
International Application No. PCT/JP2012/057269
International Filing Date 22.03.2012
IPC
C08F 299/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02from unsaturated polycondensates
08from polysiloxanes
C08F 30/08 2006.01
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
30Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
04containing a metal
08containing silicon
CPC
C08F 230/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
230Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal
04containing a metal
08containing silicon
C08F 299/08
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
299Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
02from unsaturated polycondensates
08from polysiloxanes
Applicants
  • 新日鉄住金化学株式会社 NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. [JP]/[JP] (AllExceptUS)
  • 村上 悠子 MURAKAMI Yuko [JP]/[JP] (UsOnly)
  • 齋藤 憲 SAITO Takashi [JP]/[JP] (UsOnly)
  • 湯浅 正敏 YUASA Masatoshi [JP]/[JP] (UsOnly)
Inventors
  • 村上 悠子 MURAKAMI Yuko
  • 齋藤 憲 SAITO Takashi
  • 湯浅 正敏 YUASA Masatoshi
Agents
  • 特許業務法人セントクレスト国際特許事務所 CENTCREST IP ATTORNEYS
Priority Data
2011-07949631.03.2011JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CURABLE SILICONE RESIN COMPOSITION AND CURED SILICONE RESIN
(FR) COMPOSITION DE RÉSINE SILICONE DURCISSABLE ET RÉSINE SILICONE DURCIE
(JA) 硬化性シリコーン樹脂組成物及びシリコーン樹脂硬化物
Abstract
(EN)
A curable silicon resin composition which contains a polyhedral silsesquioxane resin represented by general formula (1) and a radical polymerization initiator, with the content of the resin being 10-80% by mass. [CH2=CHSiO3/2]n[R1SiO3/2]m[R2SiO3/2]j (1) (In formula (1), R1 represents a group having a (meth)acryloyl group represented by general formula (2); R2 represents one selected from the group consisting of a hydrogen atom, an alkyl group having 1-6 carbon atoms, a phenyl group and an allyl group; n, m and j represent integers satisfying the conditions represented by formulae (i)-(iv); and in cases where m and j are 2 or more, R1 and R2 may be the same as or different from each other.) CH2=CR3-CO-O-R4- (2) (In formula (2), R3 represents a hydrogen atom or a methyl group and R4 represents a group selected from the group consisting of an alkylene group, an alkylidene group and a phenylene group.) n ≥ 1 (i) m ≥ 1 (ii) j ≥ 0 (iii) n + m + j = h (iv) (In formula (iv), h represents an integer selected from the group consisting of 8, 10, 12 and 14.)
(FR)
Cette invention concerne une composition de résine silicone durcissable qui contient une résine silsesquioxane polyédrique représentée par la formule générale (1) et un amorceur de polymérisation radicalaire, la teneur en résine étant de 10 à 80 % en poids. [CH2=CHSiO3/2]n[R1SiO3/2]m[R2SiO3/2]j (1) (Dans la formule (1), R1 représente un groupe ayant un groupe (méth)acryloyle représenté par la formule générale (2) ; R2 représente un groupe choisi dans le groupe constitué par un atome d'hydrogène, un groupe alkyle ayant 1 à 6 atomes de carbone, un groupe phényle et un groupe allyle ; n, m et j représentent des entiers satisfaisant les conditions représentées par les formules (i)-(iv) ; et dans les cas où m et j valent 2 ou plus, R1 et R2 peuvent être identiques ou différents l'un de l'autre). CH2=CR3-CO-O-R4- (2) (Dans la formule (2), R3 représente un atome d'hydrogène ou un groupe méthyle et R4 représente un groupe choisi dans le groupe constitué par un groupe alkylène, un groupe alkylidène et un groupe phénylène). n ≥ 1 (i) m ≥ 1 (ii) j ≥ 0 (iii) n + m + j = h (iv) (Dans la formule (iv), h représente un entier choisi dans le groupe constitué par 8, 10, 12 et 14).
(JA)
下記一般式(1):[CH=CHSiO[RSiO[RSiO ・・・(1){式(1)中、Rは、下記一般式(2): CH=CR-CO-O-R- ・・・(2)[式(2)中、Rは、水素原子又はメチル基を示し、Rは、アルキレン基、アルキリデン基及びフェニレン基からなる群より選択されるいずれか一種を示す。]で表わされる(メタ)アクリロイル基を有する基を示し、Rは、水素原子、炭素数1~6のアルキル基、フェニル基及びアリル基からなる群より選択されるいずれか一種を示し、n、m及びjは下記式(i)~(iv):n≧1 ・・・(i)、m≧1 ・・・(ii)、j≧0 ・・・(iii)、n+m+j=h ・・・(iv)[式(iv)中、hは8、10、12及び14からなる群より選択される整数を示す。]で表わされる条件を満たす整数を示し、m及びjがそれぞれ2以上の場合にはR及びRはそれぞれ同一でも異なっていてもよい。}で表わされるかご型シルセスキオキサン樹脂と、ラジカル重合開始剤とを含有しており、前記樹脂の含有量が10~80質量%である硬化性シリコーン樹脂組成物。
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