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Machine translation
1. (WO2012128526) NOBLE POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/128526    International Application No.:    PCT/KR2012/001963
Publication Date: 27.09.2012 International Filing Date: 19.03.2012
IPC:
C08G 73/10 (2006.01), G03F 7/028 (2006.01), C08J 5/18 (2006.01), H05K 1/03 (2006.01), C08L 79/08 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 20, Yoido-dong Youngdungpo-gu, Seoul 150-721 (KR) (For All Designated States Except US).
KYUNG, You-Jin [KR/KR]; (KR) (For US Only).
KIM, Hee-Jung [KR/KR]; (KR) (For US Only).
LEE, Kwang-Joo [KR/KR]; (KR) (For US Only).
KIM, Jung-Hak [KR/KR]; (KR) (For US Only)
Inventors: KYUNG, You-Jin; (KR).
KIM, Hee-Jung; (KR).
LEE, Kwang-Joo; (KR).
KIM, Jung-Hak; (KR)
Agent: YOU ME PATENT AND LAW FIRM; Seolim Bldg. 649-10 Yoksam-dong Kangnam-ku Seoul 135-080 (KR)
Priority Data:
10-2011-0024523 18.03.2011 KR
10-2011-0038030 22.04.2011 KR
Title (EN) NOBLE POLYAMIC ACID, PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, AND CIRCUIT BOARD
(FR) ACIDE POLYAMIQUE NOBLE, COMPOSITION DE RÉSINE PHOTOSENSIBLE, FILM SEC, ET CARTE DE CIRCUIT IMPRIMÉ
(KO) 신규한 폴리아믹산, 감광성 수지 조성물, 드라이 필름 및 회로 기판
Abstract: front page image
(EN)The present invention relates to a noble polyamic acid; a photosensitive resin composition which can provide a photosensitive material that satisfies the required characteristics of excellent flexibility and low stiffness and has excellent heat resistance and coating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.
(FR)La présente invention concerne un acide polyamique noble ; une composition de résine photosensible qui peut fournir un matériau photosensible qui satisfait les caractéristiques requises d'excellente flexibilité et de raideur réduire et possède une excellente résistance thermique et une excellente résistance d'application ; un film sec obtenu à partir de la composition de résine photosensible ; et une carte de circuit imprimé qui comprend le film sec.
(KO)본 발명은 신규한 폴리아믹산; 우수한 유연성과 낮은 강성(low stiffness) 특성을 만족시키고 우수한 내열성 및 내도금성을 나타내는 감광성 재료를 제공할 수 있는 감광성 수지 조성물; 상기 감광성 수지 조성물로부터 얻어지는 드라이 필름 및 상기 드라이 필름을 포함하는 회로 기판에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)