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1. WO2012128308 - EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRICAL OR ELECTRONIC EQUIPMENT

Publication Number WO/2012/128308
Publication Date 27.09.2012
International Application No. PCT/JP2012/057300
International Filing Date 22.03.2012
IPC
C08G 59/68 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68characterised by the catalysts used
C08J 5/24 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 5/21 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
16Nitrogen-containing compounds
21Urea; Derivatives thereof, e.g. biuret
C08K 5/49 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUSE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5Use of organic ingredients
49Phosphorus-containing compounds
C08L 63/00 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C08L 71/10 2006.1
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
71Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
08Polyethers derived from hydroxy compounds or from their metallic derivatives
10from phenols
CPC
C08G 59/3272
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
20characterised by the epoxy compounds used
32Epoxy compounds containing three or more epoxy groups
3254containing atoms other than carbon, hydrogen, oxygen or nitrogen
3272containing phosphorus
C08G 59/68
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
59Polycondensates containing more than one epoxy group per molecule
18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; ; e.g. general methods of curing
68characterised by the catalysts used
C08J 2363/04
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
2363Characterised by the use of epoxy resins; Derivatives of epoxy resins
04Epoxynovolacs
C08J 5/24
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G
5Manufacture of articles or shaped materials containing macromolecular substances
24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C08K 5/21
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
16Nitrogen-containing compounds
21Urea; Derivatives thereof, e.g. biuret
C08L 2205/02
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
2205Polymer mixtures characterised by other features
02containing two or more polymers of the same C08L -group
Applicants
  • 三菱レイヨン株式会社 Mitsubishi Rayon Co., Ltd. [JP]/[JP] (AllExceptUS)
  • 冨岡 正雄 TOMIOKA Masao [JP]/[JP] (UsOnly)
  • 金子 学 KANEKO Manabu [JP]/[JP] (UsOnly)
  • 萩原 美雪 HAGIWARA Miyuki [JP]/[JP] (UsOnly)
Inventors
  • 冨岡 正雄 TOMIOKA Masao
  • 金子 学 KANEKO Manabu
  • 萩原 美雪 HAGIWARA Miyuki
Agents
  • 志賀 正武 SHIGA Masatake
Priority Data
2011-06275122.03.2011JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND HOUSING FOR ELECTRICAL OR ELECTRONIC EQUIPMENT
(FR) COMPOSITION DE RÉSINE ÉPOXY, PRÉ-IMPRÉGNÉ, MATIÈRE COMPOSITE RENFORCÉE PAR DES FIBRES, ET BOÎTIER POUR UN ÉQUIPEMENT ÉLECTRIQUE OU ÉLECTRONIQUE
(JA) エポキシ樹脂組成物、プリプレグ、繊維強化複合材料、電子・電気機器用筐体
Abstract
(EN) Provided are: an epoxy resin composition and a prepreg which exhibit excellent curability and which can each yield a fiber -reinforced composite material having excellent flame retardance and excellent heat resistance; and a fiber-reinforced composite material and a housing for electrical or electronic equipment which are obtained using the prepreg. The epoxy resin composition comprises (A) a phosphorus compound, (B) an epoxy resin which has three or more epoxy groups in one molecule and which is not the component (A) and does not contain the component (A), (C) a curing agent for epoxy resins which has no urea structure in the molecule, and (D) a dimethylurea compound represented by formula (a) [wherein R is a hydrogen atom or C1-10 alkyl].
(FR) L'invention concerne : une composition de résine époxy et un pré-imprégné qui présentent une excellente capacité de durcissement et qui peuvent chacun produire une matière composite renforcée par des fibres ayant une excellente capacité retardatrice de flamme et une excellente résistance à la chaleur ; et une matière composite renforcée par des fibres et un boîtier pour un équipement électrique ou électronique qui sont obtenus à l'aide du pré-imprégné. La composition de résine époxy comprend (A) un composé du phosphore, (B) une résine époxy qui comporte au moins trois groupes époxy par molécule et qui n'est pas le composant (A) et qui ne contient pas le composant (A), (C) un agent de durcissement pour des résines époxy qui ne présente pas de structure d'urée dans la molécule, et (D) un composé diméthylurée représenté par la formule (a) [dans laquelle R représente un atome d'hydrogène ou alkyle en C1-10].
(JA) 硬化性に優れ、優れた難燃性を有し且つ耐熱性に優れる繊維強化複合材料を得ることができるエポキシ樹脂組成物およびプリプレグ、ならびに前記プリプレグを用いて得られる繊維強化複合材料および電気・電子機器用筐体の提供。 (A)成分:リン化合物; (B)成分:1分子に3つ以上のエポキシ基を有するエポキシ樹脂であって前記(A)成分に該当せず、かつ前記(A)成分を含有しないエポキシ樹脂; (C)成分:分子中にウレア構造を有さないエポキシ樹脂硬化剤; (D)成分:式(a)で示されるジメチルウレア化合物;を含有するエポキシ樹脂組成物。[式(a)中、Rは、水素原子または、炭素数が1~10のいずれかであるアルキル基。] を含有するエポキシ樹脂組成物。
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