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1. (WO2012127838) METHOD FOR MANUFACTURING METAL BASE WIRING BOARD, AND METAL BASE WIRING BOARD

Pub. No.:    WO/2012/127838    International Application No.:    PCT/JP2012/001859
Publication Date: Fri Sep 28 01:59:59 CEST 2012 International Filing Date: Sat Mar 17 00:59:59 CET 2012
IPC: H05K 3/44
H05K 1/02
H05K 1/05
Applicants: NHK SPRING CO., LTD.
日本発條株式会社
SAITO, Tatsuya
斉藤 達也
KOBAYASHI, Yasuyoshi
小林 康良
NAGAOKA, Eiki
長岡 栄輝
Inventors: SAITO, Tatsuya
斉藤 達也
KOBAYASHI, Yasuyoshi
小林 康良
NAGAOKA, Eiki
長岡 栄輝
Title: METHOD FOR MANUFACTURING METAL BASE WIRING BOARD, AND METAL BASE WIRING BOARD
Abstract:
Provided are a method for manufacturing a metal base wiring board, whereby the whole through hole can be suitably filled with a resin by suppressing voids, and the metal base wiring board. The method for manufacturing a metal base wiring board is characterized in that: on the rear surface of a circuit substrate (3A), which is provided with a wiring portion and a through hole (9A), and which has a power element mounted on the front surface, a metal base (7A) is laminated by having an insulating material (5A) therebetween, said insulating material being provided with heat conductivity and viscosity; lamination gaps among the circuit substrate (3A), the insulating material (5A) and the metal base (7A) are heated and pressurized by means of heat plates (25, 27); the insulating material (5A) is applied to the inside of the through hole (9A) by being moved therto, while suppressing an inner pressure increase of the through hole (9A) by releasing air through a sheet (31); and the circuit substrate, an insulating layer formed by solidifying the insulating material (5A), and the metal base are laminated.