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1. WO2012127006 - MANUFACTURING METHOD FOR A SEMICONDUCTOR ON INSULATOR TYPE SUBSTRATE FOR RADIOFREQUENCY APPLICATIONS

Publication Number WO/2012/127006
Publication Date 27.09.2012
International Application No. PCT/EP2012/055133
International Filing Date 22.03.2012
IPC
H01L 21/762 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71Manufacture of specific parts of devices defined in group H01L21/7086
76Making of isolation regions between components
762Dielectric regions
CPC
H01L 21/02052
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02041Cleaning
02043Cleaning before device manufacture, i.e. Begin-Of-Line process
02052Wet cleaning only
H01L 21/02381
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02104Forming layers
02365Forming inorganic semiconducting materials on a substrate
02367Substrates
0237Materials
02373Group 14 semiconducting materials
02381Silicon, silicon germanium, germanium
H01L 21/32155
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques
3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
321After treatment
3215Doping the layers
32155Doping polycristalline - or amorphous silicon layers
H01L 21/324
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
H01L 21/76254
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
76Making of isolation regions between components
762Dielectric regions ; , e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
7624using semiconductor on insulator [SOI] technology
76251using bonding techniques
76254with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
H01L 29/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
29Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; ; Multistep manufacturing processes therefor
02Semiconductor bodies ; ; Multistep manufacturing processes therefor
04characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
Applicants
  • SOITEC [FR]/[FR] (AllExceptUS)
  • COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES [FR]/[FR] (AllExceptUS)
  • ALLIBERT, Frédéric [FR]/[FR] (UsOnly)
  • WIDIEZ, Julie [FR]/[FR] (UsOnly)
Inventors
  • ALLIBERT, Frédéric
  • WIDIEZ, Julie
Agents
  • COLLIN, Jérôme
Priority Data
115235522.03.2011FR
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) MANUFACTURING METHOD FOR A SEMICONDUCTOR ON INSULATOR TYPE SUBSTRATE FOR RADIOFREQUENCY APPLICATIONS
(FR) PROCÉDÉ DE FABRICATION POUR UN SEMI-CONDUCTEUR SUR UN SUBSTRAT DE TYPE ISOLATEUR POUR APPLICATIONS À RADIOFRÉQUENCE
Abstract
(EN) The invention relates to a method for manufacturing a semiconductor on insulator type substrate for radiofrequency applications, comprising the following steps in sequence: (a) provision of a silicon substrate (1) with an electrical resistivity of more than 500 Ohm. cm, (b) formation of a polycrystalline silicon layer (4) on said substrate (1), said method comprising a step between steps a) and b) to form a dielectric material layer (5), different from a native oxide layer, on the substrate (1), between 0.5 and 10 nm thick.
(FR) La présente invention concerne un procédé de fabrication d'un semi-conducteur sur un substrat de type isolateur pour applications à radiofréquence, comprenant les étapes suivantes les unes à la suite des autres : (a) la fourniture d'un substrat en silicium (1) doté d'une résistivité électrique supérieure à 500 Ohm. cm, (b) la formation d'une couche de silicium polycristallin (4) sur ledit substrat (1), ledit procédé comprenant une étape entre les étapes a) et b) pour former une couche de matériau diélectrique (5), différente d'une couche d'oxyde natif, sur le substrat (1), présentant une épaisseur comprise entre 0,5 et 10 nm.
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