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1. (WO2012121036) CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2012/121036 International Application No.: PCT/JP2012/054711
Publication Date: 13.09.2012 International Filing Date: 27.02.2012
IPC:
H05K 1/14 (2006.01) ,H05K 1/02 (2006.01) ,H05K 3/00 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
Applicants: ABE, Kyutaro[JP/JP]; JP (UsOnly)
FUKAI, Hiroyuki[JP/JP]; JP (UsOnly)
KIHARA, Yasushi[JP/JP]; JP (UsOnly)
UTSUMI, Juro[JP/JP]; JP (UsOnly)
TAKAHASHI, Naomi[JP/JP]; JP (UsOnly)
FURUKAWA ELECTRIC CO.,LTD.[JP/JP]; 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322, JP (AllExceptUS)
FURUKAWA AUTOMOTIVE SYSTEMS INC.[JP/JP]; 1000, Amago, Koura-cho, Inukami-gun, Shiga 5220242, JP (AllExceptUS)
Inventors: ABE, Kyutaro; JP
FUKAI, Hiroyuki; JP
KIHARA, Yasushi; JP
UTSUMI, Juro; JP
TAKAHASHI, Naomi; JP
Agent: INOUE, Seiichi; Daisan Yamada Bldg. 7F, 22, Aizumicho, Shinjuku-ku, Tokyo 1600005, JP
Priority Data:
2011-05116609.03.2011JP
Title (EN) CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD
(FR) CARTE DE CIRCUIT ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT
(JA) 基板および基板の製造方法
Abstract:
(EN) A circuit board (1) is formed such that a printed circuit board (5) is connected to an injection molded circuit board (3). An internal circuit conductor is exposed at conductor part (15b) at a printed circuit board mounting part (11). Through holes (21) are provided in the printed circuit board (5). The conductor part (15b) is formed substantially perpendicular to the circuit board mounting part (11), and is inserted into a through hole (21). A female screw part (17) is formed in the vicinity of the conductor part (15b) printed circuit board mounting part (11). The female screw part (17) can be screwed together with a bolt (23), which is a securing member. The printed circuit board (5) is connected to the conductor part (15b) by solder (25). A hole (19) is formed in advance in the vicinity of the solder (5) on the printed circuit board (5). The bolt (23) passes through the hole (19) and is secured to the female screw part (17).
(FR) L'invention concerne une carte de circuit (1) qui est formée de sorte qu'une carte de circuit imprimé (5) soit connectée à une carte de circuit moulée par injection (3). Un conducteur de circuit interne est exposé à une partie de conducteur (15b) au niveau d'une partie de montage de carte de circuit imprimé (11). Des trous traversants (21) sont formés dans la carte de circuit imprimé (5). La partie de conducteur (15b) est essentiellement perpendiculaire à la partie de montage de carte de circuit (11), et est insérée dans un trou traversant (21). Une partie de vis femelle (17) est formée à proximité de la partie de montage de carte de circuit imprimé (11) de la partie de conducteur (15b). La partie vis femelle (17) peut être vissée à un boulon (23) qui consiste en un élément de fixation. La carte de circuit imprimé (5) est connectée à la partie de conducteur (15b) par soudure (25). Un trou (19) est formé à l'avance à proximité de la soudure (25) sur la carte de circuit imprimé (5). Le boulon (23) passe à travers le trou (19) et est fixé à la partie de vis femelle (17).
(JA)  基板1は、射出成型基板3にプリント基板5が接続されて形成される。プリント基板搭載部11では、内部の回路導体が、導体部15bにおいて露出する。プリント基板5には、スルーホール21が設けられる。導体部15bはプリント基板搭載部11に略垂直に形成され、スルーホール21に挿入される。プリント基板搭載部11の導体部15b近傍には、雌ネジ部17が形成される。雌ネジ部17は、固定部材であるボルト23と螺合可能である。プリント基板5は、導体部15bと半田25で接続される。プリント基板5の半田5近傍には、あらかじめ孔19が形成される。ボルト23は、孔19を貫通して、雌ネジ部17に固定される。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)