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Machine translation
1. (WO2012118897) ABATEMENT AND STRIP PROCESS CHAMBER IN A DUAL LOADLOCK CONFIGURATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/118897    International Application No.:    PCT/US2012/027135
Publication Date: 07.09.2012 International Filing Date: 29.02.2012
IPC:
H01L 21/67 (2006.01), H01L 21/677 (2006.01), H01L 21/683 (2006.01), H01L 21/3065 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue Santa Clara, California 95054 (US) (For All Designated States Except US).
SALINAS, Martin, Jeff [US/US]; (US) (For US Only).
REUTER, Paul, B. [US/US]; (US) (For US Only).
PAL, Aniruddha [IN/US]; (US) (For US Only).
LEE, Jared, Ahmad [US/US]; (US) (For US Only).
YOUSIF, Imad [US/US]; (US) (For US Only)
Inventors: SALINAS, Martin, Jeff; (US).
REUTER, Paul, B.; (US).
PAL, Aniruddha; (US).
LEE, Jared, Ahmad; (US).
YOUSIF, Imad; (US)
Agent: PATTERSON, Todd, B.; Patterson & Sheridan, L.L.P. 3040 Post Oak Blvd., Suite 1500 Houston, Texas 77056-6582 (US)
Priority Data:
61/448,027 01.03.2011 US
Title (EN) ABATEMENT AND STRIP PROCESS CHAMBER IN A DUAL LOADLOCK CONFIGURATION
(FR) CHAMBRE DE DÉCAPAGE ET D'ÉLIMINATION DE MATIÈRES RÉSIDUELLES PRÉSENTANT UNE CONFIGURATION DE SAS DE CHARGEMENT DOUBLE
Abstract: front page image
(EN)Embodiments of the present invention provide a dual load lock chamber capable of processing a substrate. In one embodiment, the dual load lock chamber includes a chamber body defining a first chamber volume and a second chamber volume isolated from one another. Each of the lower and second chamber volumes is selectively connectable to two processing environments through two openings configured for substrate transferring. The dual load lock chamber also includes a heated substrate support assembly disposed in the second chamber volume. The heated substrate support assembly is configured to support and heat a substrate thereon. The dual load lock chamber also includes a remote plasma source connected to the second chamber volume for supplying a plasma to the second chamber volume.
(FR)La présente invention concerne, selon des modes de réalisation, une chambre à sas de chargement double capable de traiter un substrat. Dans un mode de réalisation, ladite chambre comprend un corps de chambre définissant un premier volume de chambre et un second volume de chambre isolés l'un de l'autre. Chacun parmi le volume de chambre inférieur et le second volume de chambre peut être connecté à deux environnements de traitement par le biais de deux ouvertures conçues pour le transfert du substrat. La chambre à sas de chargement double comprend également un ensemble support de substrat chauffant installé dans le second volume de la chambre. Ledit ensemble est conçu pour supporter et chauffer un substrat sur celui-ci. La chambre à sas de chargement double comprend également une source distante de plasma connectée au second volume de la chambre pour fournir un plasma au second volume de la chambre.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)