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Machine translation
1. (WO2012118478) A SPRING LOADED LID
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2012/118478 International Application No.: PCT/US2011/026515
Publication Date: 07.09.2012 International Filing Date: 28.02.2011
IPC:
H01R 33/76 (2006.01) ,H01R 13/629 (2006.01)
Applicants: TAN, Chong S.[US/US]; US (UsOnly)
HASTINGS, Robert J.[US/US]; US (UsOnly)
ALLEN, Joseph R.[US/US]; US (UsOnly)
GILL, Michael T.[US/US]; US (UsOnly)
SMITH, Kelly K[US/US]; US (UsOnly)
SAUER, Keith A.[US/US]; US (UsOnly)
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.[US/US]; 11445 Compaq Center Drive W. Houston, Texas 77070, US (AllExceptUS)
Inventors: TAN, Chong S.; US
HASTINGS, Robert J.; US
ALLEN, Joseph R.; US
GILL, Michael T.; US
SMITH, Kelly K; US
SAUER, Keith A.; US
Agent: WEBB, Steven L; Hewlett-Packard Company Intellectual Property Administration 3404 East Harmony Road Mail Stop 35 Fort Collins, Colorado 80528, US
Priority Data:
Title (EN) A SPRING LOADED LID
(FR) COUVERCLE CHARGÉ PAR RESSORT
Abstract: front page image
(EN) A method and apparatus for loading IC's into a socket lid is disclosed. The IC is first loaded into a lid. Once the IC has been loaded into the lid, the lid is rotated into a closed position on the frame. The lid is then locked in place on the frame by rotating at least one locking lever into a closed locked position, where the locking lever forces the lid down against the socket contacts against a spring.
(FR) L'invention porte sur un procédé et un appareil pour charger des circuits intégrés dans un couvercle de douille. Le circuit intégré est tout d'abord chargé dans un couvercle. Une fois que le circuit intégré a été chargé dans le couvercle, le couvercle est tourné dans une position fermée sur le cadre. Le couvercle est ensuite verrouillé en place sur le cadre par rotation d'au moins un levier de verrouillage dans une position verrouillée fermée, le levier de verrouillage forçant le couvercle vers le bas contre les contacts de douille à l'encontre d'un ressort.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)