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1. (WO2012118083) CUTTING METHOD FOR GLASS PLATE MEMBER, AND CUTTING DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.: WO/2012/118083 International Application No.: PCT/JP2012/054955
Publication Date: 07.09.2012 International Filing Date: 28.02.2012
IPC:
C03B 33/09 (2006.01) ,B23H 1/00 (2006.01) ,B23K 26/00 (2006.01) ,B26F 3/06 (2006.01)
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33
Severing cooled glass
09
by thermal shock
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
H
WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
1
Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
F
PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
3
Severing by means other than cutting; Apparatus therefor
06
Severing by using heat
Applicants: SAITO Isao[JP/JP]; JP (UsOnly)
Asahi Glass Company, Limited[JP/JP]; 5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1008405, JP (AllExceptUS)
Inventors: SAITO Isao; JP
Agent: OGURI Shohei; Eikoh Patent Firm, Toranomon East Bldg. 10F, 7-13, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 1050003, JP
Priority Data:
2011-04606303.03.2011JP
Title (EN) CUTTING METHOD FOR GLASS PLATE MEMBER, AND CUTTING DEVICE
(FR) PROCÉDÉ DE DÉCOUPE D'UNE PLAQUE DE VERRE ET DISPOSITIF DE DÉCOUPE
(JA) 板状ガラス部材の割断方法、および割断装置
Abstract:
(EN) The present invention pertains to a method of cutting a glass plate member by moving the region that is internally heated by electrical discharge (first heating region) along a prescribed cutting line on the glass plate member, wherein the glass plate member is preheated, satisfying specific conditions, forward of the first heating region along the prescribed cutting line.
(FR) La présente invention concerne un procédé de découpe d'une plaque de verre par déplacement de la région qui est chauffée intérieurement par décharge électrique (première région de chauffage) le long d'une ligne de découpe prédéfinie sur la plaque de verre, ladite plaque de verre étant préchauffée, selon des conditions spécifiques satisfaisantes, en amont de la première région de chauffage le long de la ligne de découpe prédéfinie.
(JA)  本発明は、放電により内部加熱される部位(第1加熱部位)を板状ガラス部材の割断予定線に沿って移動させることによって、該板状ガラス部材を割断する方法であって、特定の条件を満たすように、前記第1加熱部位より前記割断予定線に沿った前方で前記板状ガラス部材を予備加熱する板状ガラス部材の割断方法に関する。
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Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)