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Machine translation
1. (WO2012116963) METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ONTO A SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/116963    International Application No.:    PCT/EP2012/053297
Publication Date: 07.09.2012 International Filing Date: 28.02.2012
IPC:
H05K 3/30 (2006.01)
Applicants: COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES [FR/FR]; 25 rue Leblanc, Bâtiment "Le Ponant D" F-75015 Paris (FR) (For All Designated States Except US).
CHARLET, Barbara [FR/FR]; (FR) (For US Only)
Inventors: CHARLET, Barbara; (FR)
Agent: ILGART, Jean-Christophe; BREVALEX 95 rue d'Amsterdam F-75378 Paris Cedex 8 (FR)
Priority Data:
11 51650 01.03.2011 FR
Title (EN) METHOD FOR ASSEMBLING ELECTRONIC COMPONENTS ONTO A SUBSTRATE
(FR) PROCEDE D'ASSEMBLAGE DE COMPOSANTS ELECTRONIQUES SUR UN SUPPORT
Abstract: front page image
(EN)The invention relates to a method for assembling at least one electronic component (100) onto a substrate (102), comprising at least the steps of: applying a treatment for rendering at least one area (116) of the substrate for receiving the electronic component hydrophilic; depositing an amount of water on said area of the substrate; dispersing a water-soluble powdered adhesive on the substrate so as to form an amount of aqueous adhesive on said area of the substrate by means of the dissolution of the powdered adhesive in the amount of water; placing an electronic component on the amount of aqueous adhesive; and drying the amount of aqueous adhesive so as to form an adhesion interface (126) securing the electronic component to the substrate.
(FR)Procédé d'assemblage d'au moins un composant électronique (100) sur un support (102), comportant au moins les étapes de : - traitement apte à rendre hydrophile au moins une zone (116) du support destinée à recevoir le composant électronique, - dépôt d'un volume d'eau sur ladite zone du support, - dispersion, sur le support, d'une colle en poudre soluble dans l'eau, formant, par dissolution de la colle en poudre dans le volume d'eau, un volume de colle aqueuse sur ladite zone du support, - placement du composant électronique sur le volume de colle aqueuse, - séchage du volume de colle aqueuse, formant une interface de collage (126) solidarisant le composant électronique au support.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: French (FR)
Filing Language: French (FR)