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Machine translation
1. (WO2012116275) LOW PROFILE CAMERA MODULE PACKAGING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/116275    International Application No.:    PCT/US2012/026501
Publication Date: 30.08.2012 International Filing Date: 24.02.2012
IPC:
H04N 5/225 (2006.01)
Applicants: FLEXTRONICS AP, LLC [US/US]; 305 Interlocken Parkway Broomfield, Colorado 80021 (US) (For All Designated States Except US).
PAVITHRAN, Prebesh [MY/MY]; (MY) (For US Only).
OOI, Yeow Thiam [MY/MY]; (MY) (For US Only).
GOH, Khen Ming [MY/MY]; (MY) (For US Only).
DARMALINGAM, Kumareson [MY/MY]; (MY) (For US Only)
Inventors: PAVITHRAN, Prebesh; (MY).
OOI, Yeow Thiam; (MY).
GOH, Khen Ming; (MY).
DARMALINGAM, Kumareson; (MY)
Agent: CROUCH, Robert, G.; Marsh Fischmann & Breyfogle LLP 8055 E. Tufts Avenue, Suite 450 Denver, CO 80237 (US)
Priority Data:
61/446,163 24.02.2011 US
13/403,610 23.02.2012 US
Title (EN) LOW PROFILE CAMERA MODULE PACKAGING
(FR) BOÎTIER PLAT DE MODULE D'APPAREIL PHOTO
Abstract: front page image
(EN)A camera module including an image sensor and a circuit substrate that are each attached to a bottom surface of a glass substrate. The image sensor is positioned between the circuit substrate and the glass substrate. This arrangement allows passive components normally associated with the image sensor to be mounted to a top surface of the glass substrate rather than to the image sensor, thus reducing the necessary size of the top surface of the image sensor, which in turn can reduce the overall size of the image sensor. A lens assembly, including a housing and a lens, is attached to the circuit substrate to position the image sensor and the glass substrate within a cavity provided in the housing.
(FR)L'invention concerne un module d'appareil photo comprenant un capteur d'image et un substrat de circuit qui sont chacun fixés à une surface inférieure d'un substrat de verre. Le capteur d'image est positionné entre le substrat de circuit et le substrat de verre. Cet agencement permet de monter des composants passifs, normalement associés au capteur d'image, sur une surface supérieure du substrat de verre plutôt que sur le capteur d'image, ce qui réduit l'encombrement de la surface supérieure du capteur d'image et, partant, celle du capteur d'image. Un ensemble objectif, comprenant un logement et un objectif, est fixé au substrat du circuit afin de positionner le capteur d'image et le substrat de verre dans une cavité formée dans le logement.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)