WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2012116218) SEMICONDUCTOR PACKAGES WITH AGGLOMERATE TERMINALS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/116218    International Application No.:    PCT/US2012/026378
Publication Date: 30.08.2012 International Filing Date: 23.02.2012
IPC:
H01L 23/488 (2006.01), H01L 21/60 (2006.01)
Applicants: TEXAS INSTRUMENTS INCORPORATED [US/US]; P.O. Box 655474, Mail Station 3999 Dallas, TX 75265-5474 (US) (For All Designated States Except US).
TEXAS INSTRUMENTS JAPAN LIMITED [JP/JP]; 24-1, Nish-shinjuku 6-chome Shinjuku-ku, Tokyo, 160-8366 (JP) (JP only).
EDWARDS, Darvin R. [US/US]; (US) (For US Only).
GURRUM, Siva P. [IN/US]; (US) (For US Only).
MURTUZA, Masood [US/US]; (US) (For US Only).
ROMIG, Matthew D. [US/US]; (US) (For US Only).
HAYATA, Kazunori [JP/JP]; (JP) (For US Only)
Inventors: EDWARDS, Darvin R.; (US).
GURRUM, Siva P.; (US).
MURTUZA, Masood; (US).
ROMIG, Matthew D.; (US).
HAYATA, Kazunori; (JP)
Agent: FRANZ, Warren L.; Texas Instruments Incorporated Deputy General Patent Counsel P.O. Box 655474, Mail Station 3999 Dallas, TX 75265-5474 (US)
Priority Data:
13/351,579 17.01.2012 US
61/445,630 23.02.2011 US
Title (EN) SEMICONDUCTOR PACKAGES WITH AGGLOMERATE TERMINALS
(FR) ENVELOPPES POUR SEMI-CONDUCTEURS À BORNES AGGLOMÉRÉES
Abstract: front page image
(EN)A plastic package (100) in which a semiconductor chip (101) is attached with adhesive (102) to a metal stripe (110a) having an agglomerate structure, and electrically connected to bondable and solderable metal stripes (120) having particulate structures; metal stripes (120) are touching metal stripes (110b) of agglomerate structure to form vertical stacks. Coats of solder (140) are welded to the agglomerate metal stripes (110a and 110b).
(FR)L'invention concerne une enveloppe plastique (100) dans laquelle une puce semi-conductrice (101) est attachée avec de l'adhésif (102) à une bande de métal (110a) ayant une structure agglomérée, et électriquement connectée à des bandes de métal pouvant être liées et brasées (120) ayant des structures particulaires ; les bandes de métal (120) touchent les bandes de métal (110b) de la structure agglomérée pour former des empilements verticaux. Des revêtements de brasure (140) sont soudés aux bandes de métal agglomérées (110a et 110b).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)