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1. (WO2012115268) SOLDER ALLOY FOR POWER DEVICE AND SOLDERED JOINT OF HIGH CURRENT DENSITY
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/115268    International Application No.:    PCT/JP2012/054774
Publication Date: 30.08.2012 International Filing Date: 27.02.2012
Chapter 2 Demand Filed:    22.11.2012    
IPC:
B23K 35/26 (2006.01), C22C 13/00 (2006.01), C22C 13/02 (2006.01), H05K 3/34 (2006.01)
Applicants: SENJU METAL INDUSTRY CO., LTD. [JP/JP]; 23, Senju-hashido-cho, Adachi-ku, Tokyo 1208555 (JP) (For All Designated States Except US).
ALBRECHT, Hans-Jurgen [DE/DE]; (DE) (For US Only).
WILKE, Klaus [DE/DE]; (DE) (For US Only).
SUGANUMA Katsuaki [JP/JP]; (JP) (For US Only).
UESHIMA Minoru [JP/JP]; (JP) (For US Only)
Inventors: ALBRECHT, Hans-Jurgen; (DE).
WILKE, Klaus; (DE).
SUGANUMA Katsuaki; (JP).
UESHIMA Minoru; (JP)
Agent: HIROSE Shoichi; Tozan Building, 4-2, Nihonbashi Honcho 4-chome, Chuo-ku, Tokyo 1030023 (JP)
Priority Data:
2011-057183 25.02.2011 JP
Title (EN) SOLDER ALLOY FOR POWER DEVICE AND SOLDERED JOINT OF HIGH CURRENT DENSITY
(FR) ALLIAGE DE BRASURE POUR DISPOSITIF ÉLECTRIQUE ET JOINT BRASÉ DE DENSITÉ DE COURANT ÉLEVÉE
(JA) パワーデバイス用のはんだ合金と高電流密度のはんだ継手
Abstract: front page image
(EN)A soldered joint capable of withstanding a high current density without the occurrence of electromigration such that it can be used in a power device and the like is formed from an Sn-Ag-Bi-In alloy. This soldered joint is formed from a solder alloy that essentially comprises 2 to 4 mass% of Ag, 2 to 4 mass% of Bi, 2 to 5 mass% of In, and Sn as the balance. This solder alloy can also contain one or more selected from Ni, Co, and Fe.
(FR)Selon l'invention, un joint brasé, qui est apte à supporter une densité de courant élevée sans créer de migration métallurgique, peut être utilisé dans un dispositif électrique et autre. Ledit joint est formé à partir d'un alliage de Sn-Ag-Bi-In. Ce joint brasé est formé à partir d'un alliage de brasure qui comprend essentiellement de 2 à 4 % en masse d'Ag, de 2 à 4 % en masse de Bi, de 2 à 5 % en masse d'In et du Sn en tant que complément. Cet alliage de brasure peut également contenir un ou plusieurs éléments choisis parmi Ni, Co et Fe.
(JA) パワーデバイスなどに用いられる、エレクトロマイグレーションが生じることなく高いで電流密度に耐えることができるはんだ継手がSn-Ag-Bi-In系合金から形成される。このはんだ継手は、2~4質量%のAg,2~4質量%のBi,2~5質量%のIn、残部Snから本質的に構成されるはんだ合金から形成される。このはんだ合金は、さらに、Ni、CoおよびFeを1種以上含有してもよい。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)