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1. (WO2012115152) ELECTRONIC DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/115152    International Application No.:    PCT/JP2012/054281
Publication Date: 30.08.2012 International Filing Date: 22.02.2012
IPC:
H05K 5/02 (2006.01)
Applicants: NEC CASIO MOBILE COMMUNICATIONS, LTD. [JP/JP]; 1753, Shimonumabe, Nakahara-ku, Kawasaki-shi, Kanagawa 2118666 (JP) (For All Designated States Except US).
NEC ACCESSTECHNICA, LTD. [JP/JP]; 800, Shimomata, Kakegawa-shi, Shizuoka 4368501 (JP) (JP only).
NTT DOCOMO, INC. [JP/JP]; 11-1, Nagatacho 2-chome, Chiyoda-ku, Tokyo 1006150 (JP) (For All Designated States Except US).
NODA, Youtarou [JP/JP]; (JP) (For US Only).
SHIRAISHI, Mitsutaka [JP/JP]; (JP) (For US Only).
HOMMA, Yasuyuki [JP/JP]; (JP) (For US Only).
YANO, Eiji [JP/JP]; (JP) (For US Only).
NAGATA, Ryuuji [JP/JP]; (JP) (For US Only).
SUGISAKI, Haruhiko [JP/JP]; (JP) (For US Only)
Inventors: NODA, Youtarou; (JP).
SHIRAISHI, Mitsutaka; (JP).
HOMMA, Yasuyuki; (JP).
YANO, Eiji; (JP).
NAGATA, Ryuuji; (JP).
SUGISAKI, Haruhiko; (JP)
Agent: KATO, Asamichi; c/o A. Kato & Associates, 20-12, Shin-Yokohama 3-chome, Kohoku-ku, Yokohama-shi, Kanagawa 2220033 (JP)
Priority Data:
2011-036620 23.02.2011 JP
Title (EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子機器
Abstract: front page image
(EN)Provided is an electronic device whereby reduced cost, smaller size, and greater thinness are implemented. An electronic device comprises a flexible substrate, a component positioned upon the flexible substrate, and a casing, further comprising an opening for housing the component. The flexible substrate is exposed via the opening in the casing when the component is absent. In the opening, the flexible substrate further comprises a flat face for positioning the component. Examples of the component would be a battery or an inscribed plate.
(FR)L'invention porte sur un dispositif électronique par lequel un coût réduit, une dimension plus petite et une plus grande minceur sont obtenus. Un dispositif électronique comprend un substrat flexible, un composant positionné sur le substrat flexible et un boîtier comprenant en outre une ouverture pour recevoir le composant. Le substrat flexible est exposé par l'intermédiaire de l'ouverture dans le boîtier lorsque le composant est absent. Dans l'ouverture, le substrat flexible comprend en outre une face plate pour le positionnement du composant. Des exemples du composant seraient une batterie ou une plaque inscrite.
(JA) 低コスト化、小型化及び薄型化を図った電子機器を提供する。電子機器は、フレキシブル基板と、フレキシブル基板上に配置された部品と、部品を収容するための開口を有する筐体と、を備える。フレキシブル基板は、部品がない状態において筐体の開口から露出している。開口において、フレキシブル基板は、部品を配置するための平面を有する。部品は、例えば、電池及び銘板である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)