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Machine translation
1. (WO2012115012) OBSERVATION DEVICE, INSPECTION DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE SUPPORT MEMBER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/115012    International Application No.:    PCT/JP2012/053864
Publication Date: 30.08.2012 International Filing Date: 17.02.2012
IPC:
H01L 21/683 (2006.01), G01N 21/956 (2006.01), H01L 21/66 (2006.01)
Applicants: NIKON CORPORATION [JP/JP]; 12-1, Yurakucho 1-chome, Chiyoda-ku, Tokyo 1008331 (JP) (For All Designated States Except US).
MINATO, Kazuharu [JP/JP]; (JP) (For US Only).
INOUE, Takeshi [JP/JP]; (JP) (For US Only)
Inventors: MINATO, Kazuharu; (JP).
INOUE, Takeshi; (JP)
Agent: KAWAKITA, Kijuro; YKB Mike Garden, 5-4, Shinjuku 1-chome, Shinjuku-ku, Tokyo 1600022 (JP)
Priority Data:
2011-040921 25.02.2011 JP
Title (EN) OBSERVATION DEVICE, INSPECTION DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE SUPPORT MEMBER
(FR) DISPOSITIF D'OBSERVATION, DISPOSITIF D'INSPECTION, PROCÉDÉ DE FABRICATION D'UN DISPOSITIF À SEMI-CONDUCTEUR ET ÉLÉMENT DE SUPPORT DE SUBSTRAT
(JA) 観察装置、検査装置、半導体装置の製造方法、および基板支持部材
Abstract: front page image
(EN)The present invention suppresses reductions in inspection precision caused by reflected and scattered light produced by wafer holders. In a wafer holder (10) that has protruding support parts (11) that contact and support a wafer and groove parts (12) that are separated from the wafer, the protruding support parts (11) are extended continuously from a part that supports one edge of the wafer to a part that supports the other edge of the wafer. Connecting parts (13) that connect adjacent protruding support parts (11) are provided in each of the vicinity of the parts supporting the one edge and the vicinity of the parts supporting the other edge.
(FR)La présente invention élimine les diminutions de la précision d'inspection provoquées par la lumière réfléchie et dispersée produite par les supports de tranche. Dans un support de tranche (10) présentant des parties de support en saillie (11) en contact avec une tranche et portant celle-ci et des parties rainure (12) séparées de la tranche, les parties de support en saillie (11) sont étendues en continu d'une partie portant un bord de la tranche à une partie portant l'autre bord de la tranche. Des parties de raccordement (13) raccordant les parties de support en saillie adjacentes (11) sont disposées au voisinage des parties portant l'un des bords et au voisinage des parties portant l'autre bord.
(JA) ウェハホルダで生じた反射散乱光により検査精度が低下することを抑制する。 ウェハと接触して支持する凸状の支持部11と、ウェハと離間する溝部12とを有するウェハホルダ10において、凸状の支持部11は、ウェハの一端を支持する部分から他端を支持する部分に連続して延在し、一端を支持する部分の近傍と他端を支持する部分の近傍にそれぞれ、隣り合う凸状の支持部11を連結する連結部13が設けられる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)