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1. (WO2012112618) MULTI-BAND INTERCONNECT FOR INTER-CHIP AND INTRA-CHIP COMMUNICATIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/112618    International Application No.:    PCT/US2012/025132
Publication Date: 23.08.2012 International Filing Date: 14.02.2012
IPC:
G11C 7/10 (2006.01), G11C 7/22 (2006.01), G11C 11/4096 (2006.01), G06F 13/14 (2006.01)
Applicants: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA [US/US]; 1111 Franklin Street, 12th Floor Oakland, California 94607-5200 (US) (For All Designated States Except US).
CHANG, Mau-Chung [US/US]; (US) (For US Only).
TAM, Sai-Wang [US/US]; (US) (For US Only).
BYUN, Gyung-Su [KR/US]; (US) (For US Only).
KIM, Yanghyo [KR/US]; (US) (For US Only).
THERDSTEERASUKDI, Kanit [US/US]; (US) (For US Only).
IR, Jeremy [US/US]; (US) (For US Only).
REINMAN, Glenn [US/US]; (US) (For US Only).
CONG, Jingsheng [US/US]; (US) (For US Only)
Inventors: CHANG, Mau-Chung; (US).
TAM, Sai-Wang; (US).
BYUN, Gyung-Su; (US).
KIM, Yanghyo; (US).
THERDSTEERASUKDI, Kanit; (US).
IR, Jeremy; (US).
REINMAN, Glenn; (US).
CONG, Jingsheng; (US)
Agent: O'BANION, John; O'banion & Ritchey LLP 400 Capitol Mall, Suite 1550 Sacramento, California 95814 (US)
Priority Data:
61/442,557 14.02.2011 US
61/443,154 15.02.2011 US
61/513,732 01.08.2011 US
Title (EN) MULTI-BAND INTERCONNECT FOR INTER-CHIP AND INTRA-CHIP COMMUNICATIONS
(FR) INTERCONNEXION MULTI-BANDES POUR COMMUNICATIONS INTER-PUCES ET INTRA-PUCES
Abstract: front page image
(EN)Systems, apparatus, modules, and methods of communicating with memory devices utilizing multi-band communication containing a baseband and one or more amplitude shift keyed (ASK) RF channels over each differential pair of off-chip transmission lines. Configurations are described for interfacing between microprocessors, or controllers and memory devices or modules, and within a DIMM and its DRAM devices, and between multiple DIMM memory modules.
(FR)L'invention concerne des systèmes, un appareil, des modules et des procédés permettant de communiquer avec des dispositifs mémoire au moyen d'une communication multi-bandes contenant une bande de base et un ou plusieurs canaux RF manipulés en amplitude sur chaque paire différentielle de lignes de transmission hors puce. L'invention concerne des configurations permettant l'interfaçage entre des microprocesseurs, ou des contrôleurs et des dispositifs ou modules mémoire, et dans un DIMM et ses dispositifs DRAM, et entre plusieurs modules de mémoire DIMM.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)