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Machine translation
1. (WO2012111868) SUBSTRATE-PROCESSING SYSTEM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/111868    International Application No.:    PCT/KR2011/001231
Publication Date: 23.08.2012 International Filing Date: 23.02.2011
IPC:
H01L 21/304 (2006.01)
Applicants: HANSOL TECHNICS INC. [KR/KR]; 736-1 Yeoksam-dong, Gangnam-gu Seoul 135-080 (KR) (For All Designated States Except US).
KANG, Jin-Ki [KR/KR]; (KR) (For US Only).
MA, Jae-Young [KR/KR]; (KR) (For US Only).
PARK, Hong-Jin [KR/KR]; (KR).
LEE, Kyoung-Ho [KR/KR]; (KR) (For US Only)
Inventors: KANG, Jin-Ki; (KR).
MA, Jae-Young; (KR).
PARK, Hong-Jin; (KR).
LEE, Kyoung-Ho; (KR)
Agent: SONG, Kyeong-Keun; 3rd Floor Wells Building 1621-25 Seocho-dong, Seocho-gu Seoul 137-878 (KR)
Priority Data:
10-2011-0013733 16.02.2011 KR
Title (EN) SUBSTRATE-PROCESSING SYSTEM
(FR) SYSTÈME DE TRAITEMENT DE SUBSTRAT
(KO) 기판처리시스템
Abstract: front page image
(EN)The present invention relates to a substrate-processing system, which imparts a uniform roughness to a back surface of the substrate using sand blasting. The substrate-processing system includes: a slicing unit for slicing an ingot into a wafer shape; a sand blasting unit for spraying a polishing material onto at least one surface from among the two surfaces of the substrate sliced into the wafer shape so as to perform sand blasting; a heat treatment unit for heat-treating the sand-blasted substrate; and a polishing unit for polishing the entire surface of the heat-treated substrate.
(FR)L'invention concerne un système de traitement d'un substrat qui confère une rugosité uniforme à une surface dorsale d'un substrat par projection de sable. Ce système de traitement de substrat comprend une unité de tranchage pour trancher un lingot en une tranche; une unité de sablage pour projeter un matériau de polissage sur au moins une des deux surfaces du substrat tranché, afin de réaliser la projection de sable; une unité de traitement thermique pour traiter thermiquement le substrat qui a subi le sablage; et une unité de polissage pour polir la totalité de la surface du substrat traité thermiquement.
(KO)본 발명은 샌드 블라스팅을 이용하여 기판의 후면에 균일한 거칠기를 부여하는 기판처리시스템에 관한 것이다. 본 발명에 따른 기판처리시스템은 잉곳(ingot)을 웨이퍼 형태로 절단(slicing)하는 절단유닛과, 상기 웨이퍼 형태로 절단된 기판의 양면 중 적어도 일면에 연마재를 분사하여 샌드 블라스팅(sand blasting)하는 샌드 블라스팅 유닛과, 상기 샌드 블라스팅된 기판을 열처리하는 열처리 유닛과, 상기 열처리된 기판의 전면을 경면 연마하는 폴리싱(polishing) 유닛을 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)