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1. WO2012111809 - SERIES OF NOZZLES, AND SUBSTRATE TREATMENT APPARATUS PROVIDED WITH SERIES OF NOZZLES

Publication Number WO/2012/111809
Publication Date 23.08.2012
International Application No. PCT/JP2012/053828
International Filing Date 17.02.2012
IPC
H01L 21/304 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/027 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
027Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L21/18 or H01L21/34165
CPC
H01L 21/67051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67051using mainly spraying means, e.g. nozzles
Applicants
  • アクアサイエンス株式会社 Aqua Science Corporation [JP]/[JP] (AllExceptUS)
  • 松下 亮 MATSUSHITA Ryo [JP]/[JP] (UsOnly)
  • 廣川 昌利 HIROKAWA Masatoshi [JP]/[JP] (UsOnly)
  • 林田 充司 HAYASHIDA Atsushi [JP]/[JP] (UsOnly)
  • ガイエッタ、ワリー GAYETA Wally [PH]/[JP] (UsOnly)
Inventors
  • 松下 亮 MATSUSHITA Ryo
  • 廣川 昌利 HIROKAWA Masatoshi
  • 林田 充司 HAYASHIDA Atsushi
  • ガイエッタ、ワリー GAYETA Wally
Agents
  • 伊藤 温 ITOH Atsushi
Priority Data
2011-03267717.02.2011JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SERIES OF NOZZLES, AND SUBSTRATE TREATMENT APPARATUS PROVIDED WITH SERIES OF NOZZLES
(FR) SÉRIE DE BUSES, ET APPAREIL DE TRAITEMENT DE SUBSTRAT POURVU D'UNE SÉRIE DE BUSES
(JA) 複連ノズル及び当該複連ノズルを備える基板処理装置
Abstract
(EN) [Objective] To provide nozzles and a substrate treatment apparatus, wherein a broad area of a substrate can be treated efficiently, by scanning. [Solution] This series of nozzles (1) comprises a section of multiple nozzles (10) provided with acceleration nozzles (100) comprising: first gas introduction holes (101); first liquid introduction holes (103) provided downstream of the first gas introduction holes (101); acceleration flow paths (105) for accelerating gas supplied from the first gas introduction holes (101) and liquid supplied from the first liquid introduction holes (103); and ejection nozzles (107) through which the accelerated multiphase fluids are ejected. In the section of multiple nozzles (10), the acceleration nozzles (100) are arranged in parallel.
(FR) L'invention a pour objectif de proposer des buses et un appareil de traitement de substrat, dans lesquels une large superficie d'un substrat peut être traitée efficacement, par balayage. Pour ce faire, l'invention propose une série de buses (1) comprenant une section de multiples buses (10) pourvue de buses d'accélération (100) comprenant : des premiers trous d'introduction de gaz (101) ; des premiers trous d'introduction de liquide (103) disposés en aval des premiers trous d'introduction de gaz (101) ; des chemins d'écoulement d'accélération (105) permettant d'accélérer le gaz fourni à partir des premiers trous d'introduction de gaz (101) et le liquide fourni à partir des premiers trous d'introduction de liquide (103) ; et des buses d'éjection (107) à travers lesquelles les fluides multiphases accélérés sont éjectés. Dans la section des multiples buses (10), les buses d'accélération (100) sont agencées en parallèle.
(JA) 【課題】スキャンによって効率的に広い面積の基板を処理できるノズル及び基板処理装置の提供。【解決手段】第一の気体導入孔(101)、前記第一の気体導入孔(101)よりも下流に設けられた第一の液体導入孔(103)、該第一の気体導入孔(103)から供給された気体及び第一の液体導入孔(103)から供給された液体を加速する加速流路(105)、及び加速された混相流体が噴射される噴出口(107)を有する加速ノズル(100)を備え、該加速ノズルが並列に配されている、複連加速ノズル部(10)を具備する複連ノズル(1)。
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