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1. (WO2012111314) INSULATING MATERIAL FORMING COMPOSITION FOR ELECTRONIC ELEMENTS, INSULATING MATERIAL FOR ELECTRONIC ELEMENTS, ELECTRONIC ELEMENT, AND THIN FILM TRANSISTOR
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/111314    International Application No.:    PCT/JP2012/000961
Publication Date: 23.08.2012 International Filing Date: 14.02.2012
IPC:
H01L 21/312 (2006.01), C08F 20/20 (2006.01), C08F 20/28 (2006.01), H01L 29/786 (2006.01), H01L 51/05 (2006.01), H01L 51/30 (2006.01)
Applicants: IDEMITSU KOSAN CO., LTD. [JP/JP]; 1-1, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1008321 (JP) (For All Designated States Except US).
KURIHARA, Naoki [JP/JP]; (JP) (For US Only).
SAITO, Masatoshi [JP/JP]; (JP) (For US Only)
Inventors: KURIHARA, Naoki; (JP).
SAITO, Masatoshi; (JP)
Agent: WATANABE, Kihei; Shibashin Kanda Bldg. 3rd Floor, 26, Kanda Suda-cho 1-chome, Chiyoda-ku, Tokyo 1010041 (JP)
Priority Data:
2011-033107 18.02.2011 JP
Title (EN) INSULATING MATERIAL FORMING COMPOSITION FOR ELECTRONIC ELEMENTS, INSULATING MATERIAL FOR ELECTRONIC ELEMENTS, ELECTRONIC ELEMENT, AND THIN FILM TRANSISTOR
(FR) COMPOSITION DE FORMATION DE MATÉRIAU ISOLANT POUR ÉLÉMENTS ÉLECTRONIQUES, MATÉRIAU ISOLANT POUR ÉLÉMENTS ÉLECTRONIQUES, ÉLÉMENT ÉLECTRONIQUE ET TRANSISTOR À COUCHE MINCE
(JA) 電子素子用絶縁材料形成用組成物、電子素子用絶縁材料、電子素子及び薄膜トランジスタ
Abstract: front page image
(EN)An insulting material forming composition for electronic elements, which contains, as a polymerizable component, a monomer that has two or more (meth)acrylic moieties and a polycyclic alicyclic structure.
(FR)La présente invention concerne une composition de formation de matériau isolant pour éléments électroniques qui contient, comme élément polymérisable, un monomère présentant deux fractions (méth)acryliques ou plus et une structure alicyclique polycyclique.
(JA)2以上の(メタ)アクリル部位と、多環の脂環式構造を有するモノマーを、重合性成分として含む電子素子用絶縁材料形成用組成物。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)