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1. (WO2012109979) DEVICES HAVING ANISOTROPIC CONDUCTIVITY HEATSINKS, AND METHODS OF MAKING THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/109979    International Application No.:    PCT/CN2012/071118
Publication Date: 23.08.2012 International Filing Date: 14.02.2012
IPC:
H05K 7/20 (2006.01)
Applicants: HUAWEI TECHNOLOGIES CO., LTD. [CN/CN]; Huawei Administration Building, Bantian, Longgang, Shenzhen Guangdong 518129 (CN) (For All Designated States Except US).
MOHAMMED, Anwar [US/US]; (US) (For US Only).
ZHAO, Renzhe [US/US]; (US) (For US Only)
Inventors: MOHAMMED, Anwar; (US).
ZHAO, Renzhe; (US)
Priority Data:
61/442,552 14.02.2011 US
13/071,015 24.03.2011 US
Title (EN) DEVICES HAVING ANISOTROPIC CONDUCTIVITY HEATSINKS, AND METHODS OF MAKING THEREOF
(FR) DISPOSITIFS COMPRENANT DES DISSIPATEURS THERMIQUES À CONDUCTIVITÉ ANISOTROPE ET LEURS PROCÉDÉS DE FABRICATION
Abstract: front page image
(EN)In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.
(FR)Selon un mode de réalisation, cette invention concerne un dispositif comprenant une carte de circuit imprimé présentant une couche centrale à conductivité thermique et une puce disposée au-dessus de la carte de circuit imprimé. Ledit dispositif comprend en outre un dissipateur thermique disposé au-dessus de la puce. La conductivité thermique du dissipateur thermique le long d'une première direction est supérieure à sa conductivité thermique le long d'une seconde direction. Ladite première direction est perpendiculaire à la seconde direction. Le dissipateur thermique est thermiquement couplé à la couche centrale à conductivité thermique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)