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Machine translation
1. (WO2012109861) HEAT SINK, ELECTRONIC DEVICE AND MOUNTING METHOD THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/109861    International Application No.:    PCT/CN2011/077803
Publication Date: 23.08.2012 International Filing Date: 29.07.2011
IPC:
H01L 23/40 (2006.01), H05K 7/20 (2006.01), G12B 15/06 (2006.01)
Applicants: HUAWEI TECHNOLOGIES CO., LTD. [CN/CN]; Huawei Administration Building Bantian, Longgang District Shenzhen, Guangdong 518129 (CN) (For All Designated States Except US).
ZHU, Xiaoming [CN/CN]; (CN) (For US Only).
SUN, Jiadong [CN/CN]; (CN) (For US Only)
Inventors: ZHU, Xiaoming; (CN).
SUN, Jiadong; (CN)
Agent: BEIJING ZBSD PATENT & TRADEMARK AGENT LTD.; 501/B, Fortune Building No.17 Daliushu Road Haidian District, Beijing 100081 (CN)
Priority Data:
Title (EN) HEAT SINK, ELECTRONIC DEVICE AND MOUNTING METHOD THEREOF
(FR) DISSIPATEUR THERMIQUE, DISPOSITIF ÉLECTRONIQUE ET PROCÉDÉ POUR LEUR MONTAGE
(ZH) 散热器、电子设备及其安装方法
Abstract: front page image
(EN)Provided are a heat sink, a mounting method thereof, and an electronic device. The heat sink comprises a base (1) and fins (12), wherein the base (11) is provided with sucking discs (2), and the sucking discs (2) are used to suck the heat sink to a printed circuit board (3) using atmospheric pressure.
(FR)L'invention concerne un dissipateur thermique, un procédé pour son montage et un dispositif électronique. Le dissipateur thermique comporte une semelle (1) et des ailettes (12), la semelle (11) étant munie de ventouses (2) et les ventouses (2) étant utilisées pour plaquer le dissipateur thermique sur une carte (3) à circuits imprimés en utilisant la pression atmosphérique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)