WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2012108835) CLEANING PROCESS FOR BOND SURFACE CONTAMINATION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/108835    International Application No.:    PCT/SG2011/000061
Publication Date: 16.08.2012 International Filing Date: 10.02.2011
IPC:
H01L 21/60 (2006.01), H01L 21/02 (2006.01), C23G 5/00 (2006.01), B23K 20/24 (2006.01)
Applicants: KATHAROS ADHESION TECHNOLOGIES PTE. LTD. [SG/SG]; 179 River Valley Road #05-11, River Valley Building Singapore 179033 (SG) (For All Designated States Except US).
ALCALA, Debbie, T. [PH/SG]; (SG) (For US Only).
MOK, Phoi, Ching [MY/MY]; (MY) (For US Only)
Inventors: ALCALA, Debbie, T.; (SG).
MOK, Phoi, Ching; (MY)
Agent: NAMAZIE, Farah; Namazie & Co P.O. Box 1482 Robinson Road Post Office Singapore 902932 (SG)
Priority Data:
Title (EN) CLEANING PROCESS FOR BOND SURFACE CONTAMINATION
(FR) PROCÉDÉ DE NETTOYAGE PERMETTANT D'ÉLIMINER LES CONTAMINANTS D'UNE SURFACE DE FIXATION
Abstract: front page image
(EN)In one aspect, the present invention relates generally to a process for cleaning, particularly wet cleaning, a surface for wire-bonding. The process comprises the steps of (i) removing electrical charges from the surface, (ii) removing contaminants from the surface with a stripping solution, (iii) rinsing the surface with a rinsing agent, and (iv) drying the surface. In another aspect, the present invention relates broadly to a process for bonding wire attachment comprising the above steps of the cleaning process and a subsequent step of attaching of a bonding wire to the cleaned surface.
(FR)Selon un aspect, l'invention concerne en général un procédé de nettoyage, en particulier un procédé de nettoyage par voie humide, d'une surface de fixation de fil. Le procédé comprend les étapes consistant : (i) à éliminer les charges électriques de la surface, (ii) à éliminer les contaminants de la surface au moyen d'une solution de décapage, (iii) à rincer la surface au moyen d'un agent de rinçage, et (iv) à sécher la surface. Selon un autre aspect, l'invention concerne en général un procédé de fixation d'un fil de connexion comprenant les étapes précitées du procédé de nettoyage et une étape ultérieure de fixation d'un fil de connexion sur la surface nettoyée.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)