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Machine translation
1. (WO2012108150) MAGNETRON SPUTTERING DEVICE, METHOD FOR CONTROLLING MAGNETRON SPUTTERING DEVICE, AND FILM FORMING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/108150    International Application No.:    PCT/JP2012/000710
Publication Date: 16.08.2012 International Filing Date: 02.02.2012
IPC:
C23C 14/34 (2006.01)
Applicants: SHARP KABUSHIKI KAISHA [JP/JP]; 22-22, Nagaike-cho, Abeno-ku, Osaka-shi, Osaka 5458522 (JP) (For All Designated States Except US).
YOSHIDA, Tokuo; (For US Only)
Inventors: YOSHIDA, Tokuo;
Agent: MAEDA & PARTNERS; Osaka-Marubeni Bldg.5F, 5-7, Hommachi 2-chome, Chuo-ku, Osaka-shi, Osaka 5410053 (JP)
Priority Data:
2011-024876 08.02.2011 JP
Title (EN) MAGNETRON SPUTTERING DEVICE, METHOD FOR CONTROLLING MAGNETRON SPUTTERING DEVICE, AND FILM FORMING METHOD
(FR) DISPOSITIF DE PULVÉRISATION À MAGNÉTRON, PROCÉDÉ POUR COMMANDER UN DISPOSITIF DE PULVÉRISATION À MAGNÉTRON, ET PROCÉDÉ DE FORMATION DE FILM
(JA) マグネトロンスパッタリング装置、マグネトロンスパッタリング装置の制御方法、及び成膜方法
Abstract: front page image
(EN)In a magnetron sputtering device, an AC power supply is connected to each set of first and second targets, and a control unit is provided that controls the phase difference between the respective voltages output from the AC power supplies connected to the first and second targets in mutually adjacent sets.
(FR)La présente invention concerne un dispositif de pulvérisation à magnétron, dans lequel une alimentation CA est connectée à chaque ensemble de premières et deuxièmes cibles, et une unité de commande est disposée et commande le déphasage entre les tensions respectives transmises par les alimentations CA connectées aux premières et deuxièmes cibles dans des ensembles mutuellement adjacents.
(JA) マグネトロンスパッタリング装置は、第1ターゲット及び第2ターゲットに対して各組毎に交流電源が接続され、互いに隣り合う組において第1ターゲット及び第2ターゲットに接続されている交流電源からそれぞれ出力される各電圧の位相差を制御する制御部を備えている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)