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Machine translation
1. (WO2012104110) METHOD FOR PRODUCING A COMPLEX SMOOTH MICROMECHANICAL PART
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/104110    International Application No.:    PCT/EP2012/050127
Publication Date: 09.08.2012 International Filing Date: 05.01.2012
Chapter 2 Demand Filed:    12.11.2012    
IPC:
B81C 99/00 (2010.01)
Applicants: NIVAROX-FAR S.A. [CH/CH]; Avenue du Collège 10 CH-2400 Le Locle (CH) (For All Designated States Except US).
CUSIN, Pierre [CH/CH]; (CH) (For US Only).
RICHARD, David [FR/CH]; (CH) (For US Only).
DUBOIS, Philippe [CH/CH]; (CH) (For US Only)
Inventors: CUSIN, Pierre; (CH).
RICHARD, David; (CH).
DUBOIS, Philippe; (CH)
Agent: ICB INGÉNIEURS CONSEILS EN BREVETS SA; Fbg de l'Hôpital 3 CH-2001 Neuchâtel (CH)
Priority Data:
11153243.8 03.02.2011 EP
Title (EN) METHOD FOR PRODUCING A COMPLEX SMOOTH MICROMECHANICAL PART
(FR) METHODE DE FABRICATION D'UNE PIECE DE MICROMECANIQUE COMPLEXE ET A FAIBLE RUGOSITE
Abstract: front page image
(EN)The invention relates to a method for producing a micromechanical part (11, 21, 31, 41, 51, 61) from a single piece of material. The method comprises the following steps: a) forming a substrate (1) comprising a negative impression (3) of said micromechanical part to be manufactured; b) covering said negative impression of the substrate (1) with a layer (5) of a material; c) removing a layer, the thickness (e1) of which is greater than that (e1) of the deposited layer (5), from the substrate (1), so as to leave a portion of said deposited layer contained within said negative impression; removing the substrate (1) in order to release the micromechanical part (11, 21, 31, 41, 51, 61) formed in said negative impression.
(FR)L'invention se rapporte à un procédé de fabrication d'une pièce de micromécanique (11, 21, 31, 41, 51, 61) en un matériau monobloc. Le procédé comporte les étapes suivantes : a) former un substrat (1) comportant l'empreinte (3) négative de ladite pièce de micromécanique à fabriquer; b) recouvrir ladite empreinte négative du substrat (1) d'une couche (5) d'un matériau; c) retirer du substrat (1) une épaisseur supérieure (e2) à celle (e1) de la couche déposée (5) afin de laisser une épaisseur de ladite couche circonscrite dans ladite empreinte négative; d) retirer le substrat (1) afin de laisser libre la pièce de micromécanique (11, 21, 31, 41, 51, 61) formée dans ladite empreinte négative.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: French (FR)
Filing Language: French (FR)