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Machine translation
1. (WO2012103928) ARRANGEMENT OF CARRIERS FOR OPTOELECTRONIC CHIPS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/103928    International Application No.:    PCT/EP2011/051322
Publication Date: 09.08.2012 International Filing Date: 31.01.2011
IPC:
H01L 21/683 (2006.01)
Applicants: OSRAM OPTO SEMICONDUCTORS GMBH [DE/DE]; Leibnizstrasse 4 Regensburg 93055 (DE) (For All Designated States Except US).
WONG, Lye, Yee [MY/MY]; (MY) (For US Only).
YEOH, Mei, Ling [MY/MY]; (MY) (For US Only)
Inventors: WONG, Lye, Yee; (MY).
YEOH, Mei, Ling; (MY)
Agent: EPPING HERMANN FISCHER Patentanwaltsgesellschaft mbH; Ridlerstrasse 55 80339 München (DE)
Priority Data:
Title (EN) ARRANGEMENT OF CARRIERS FOR OPTOELECTRONIC CHIPS
(FR) AGENCEMENT DE SUPPORTS POUR PUCES OPTOÉLECTRONIQUES
Abstract: front page image
(EN)An arrangement of carriers (10) for optoelectronic chips (4) comprising - a base body (1) formed with a ceramic material, - a plurality of chip connection regions (2), and - a protection metallization (3), wherein - the base body (1) comprises a top surface (1a), a bottom surface (1c) and at least one side surface (1b) which connects the top surface (1a) with the bottom surface (1c), - the chip connection regions (2) are arranged on the top surface (1a) of the base body (2), - each chip connection regions (2) is configured to carry at least one optoelectronic chip (4), - the protection metallization (3) covers all side surfaces (1b) of the base body (1) is specified.
(FR)L'invention porte sur un agencement de supports (10) pour des puces optoélectroniques (4) comprenant - un corps de base (1) constitué d'un matériau céramique, - une pluralité de régions de connexion de puce (2), et - une métallisation de protection (3), - le corps de base comprenant une surface supérieure (1a), une surface inférieure (1c) et au moins une surface latérale (1b) qui relie la surface supérieure (1a) à la surface inférieure (1c), - les régions de connexion de puce (2) étant agencées sur la surface supérieure (1a) du corps de base (2), - chaque région de connexion de puce (2) étant configurée pour porter au moins une puce optoélectronique (4), - la métallisation de protection (3) recouvrant toutes les surfaces latérales (1b) du corps de base (1).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)