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Machine translation
1. (WO2012102578) ZINC NANOPARTICLES HAVING LOW MELTING POINT, AND PREPARATION METHOD THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/102578    International Application No.:    PCT/KR2012/000643
Publication Date: 02.08.2012 International Filing Date: 29.01.2012
IPC:
C25C 5/02 (2006.01)
Applicants: KIM, Young Sang [KR/KR]; (KR)
Inventors: KIM, Young Sang; (KR)
Agent: YU, Jong Wan; 907 Maters Tower Bldg. 553 Dowha-dong Mapo-gu Seoul 121-748 (KR)
Priority Data:
10-2011-0008546 28.01.2011 KR
Title (EN) ZINC NANOPARTICLES HAVING LOW MELTING POINT, AND PREPARATION METHOD THEREOF
(FR) NANOPARTICULES DE ZINC À BAS POINT DE FUSION ET LEUR PROCÉDÉ DE PRÉPARATION
(KO) 낮은 용융 온도를 가지는 아연 나노입자 및 그 제조방법
Abstract: front page image
(EN)The present invention relates to nanoparticles having a size of 1-20 nm prepared by the electrolysis of zinc, and a preparation method thereof. The nanoparticles are surface melted at 111-130 ℃. A solder ball comprising the nanoparticles can be sintered at a temperature of 180 ℃ or lower, thereby providing the following advantages: First, since the heating temperature can be lowered from 240 ℃ to 180 ℃ in the case of a reflow process, a conventional reflow apparatus consuming 74 kW can be operated with 56 kW, thereby leading to a reduction in energy by 24%. Second, since the deformation of a PCB is minimized by lowering the temperature of a reflow process and a cheap polymer material such as PET having a low glass transition temperature can be used, it is possible to create the field to which a mounting material having a low unit cost is applied. Third, if using nanoparticles having a size of 10 nm or less, the uniformity of a solder paste on a pad can be increased, and the limit of micro-patterning in a nano-solder ink can be overcome due to the small size of particles (figure 4).
(FR)La présente invention concerne des nanoparticules dont la taille est de 1 à 20 nm et qui sont préparées par électrolyse du zinc, ainsi que leur procédé de préparation. Les nanoparticules sont fondues en surface à 111-130 °C. Une bille de soudure comprenant les nanoparticules peut être frittée à une température de 180 °C ou moins, ce qui procure ainsi les avantages suivants. Premièrement, étant donné que la température de chauffage peut être baissée de 240 °C à 180 °C dans le cas d'un processus de reflow, un dispositif de reflow conventionnel consommant 74 kW peut fonctionner avec 56 kW, ce qui permet donc une réduction énergétique de 24 %. Deuxièmement, étant donné que la déformation d'un CI est minimisée en baissant la température du processus de reflow et que l'on peut utiliser un matériau polymère peu coûteux tel que le PET ayant une basse température de transition vitreuse, il est possible de créer le champ sur lequel on applique un matériau de montage ayant un faible coût unitaire. Troisièmement, si l'on utilise des nanoparticules ayant une taille de 10 nm ou moins, il est possible d'améliorer l'homogénéité de la pâte à souder sur une pastille et la limite de micromatriçage d'une encre à nano-soudure peut être surmontée grâce à la petite taille des particules (figure 4).
(KO)본 발명은 아연을 전기분해하여 제조된 1∼20㎚ 크기의 나노입자 및 그 제조방법에 관하여 개시한다. 상기 나노입자는 111∼130℃의 온도 범위에서 표면 용융된다. 상기 나노 입자를 함유한 솔더 볼은 180℃ 이하에서 소결 할 수 있는바, 첫째 Rflow 공정시 가열 온도를 240℃에서 180℃까지 낮출 수 있기 때문에 기존에 사용되고 있는 74㎾의 에너지를 소모하는 Reflow 공정 장치를 56㎾의 에너지 사용으로 해결할 수 있어 24%의 에너지를 절약할 수 있다. 둘째 Reflow 공정의 온도를 낮춰 PCB 보드의 변형을 최소화할 수 있고, 유리전이 온도가 낮은 PET와 같은 저가 고분자 재료를 사용할 수 있게 됨으로써 단가가 저렴한 실장 재료의 적용 분야가 창출될 수 있다. 그리고 셋째 10㎚ 이하 크기의 나노입자를 사용할 경우 패드 위의 솔더 페이스트 균일성을 높일 수 있고 나노 솔더 잉크의 경우 입자의 크기가 작음으로 인해 미세 Patterning의 한계를 극복할 수 있다(도 4).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)