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1. (WO2012102212) RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FOIL ATTACHED, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD, AND LED LIGHT SOURCE MEMBER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/102212    International Application No.:    PCT/JP2012/051263
Publication Date: 02.08.2012 International Filing Date: 20.01.2012
IPC:
C08J 5/18 (2006.01), B32B 15/08 (2006.01), C08G 59/62 (2006.01), C08K 3/00 (2006.01), C08L 63/00 (2006.01), H05K 1/03 (2006.01), H05K 1/05 (2006.01)
Applicants: Hitachi Chemical Company, Ltd. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP) (For All Designated States Except US).
NISHIMURA, Masato [JP/JP]; (JP) (For US Only).
MIYAZAKI, Yasuo [JP/JP]; (JP) (For US Only).
AMANUMA, Shinji [JP/JP]; (JP) (For US Only).
TANAKA, Hiroyuki [JP/JP]; (JP) (For US Only).
HARA, Naoki [JP/JP]; (JP) (For US Only)
Inventors: NISHIMURA, Masato; (JP).
MIYAZAKI, Yasuo; (JP).
AMANUMA, Shinji; (JP).
TANAKA, Hiroyuki; (JP).
HARA, Naoki; (JP)
Agent: KOBAYASHI, Miki; TAIYO, NAKAJIMA & KATO, Seventh Floor, HK-Shinjuku Bldg., 3-17, Shinjuku 4-chome, Shinjuku-ku, Tokyo 1600022 (JP)
Priority Data:
2011-013420 25.01.2011 JP
Title (EN) RESIN COMPOSITION SHEET, RESIN COMPOSITION SHEET WITH METAL FOIL ATTACHED, METAL BASE WIRING BOARD MATERIAL, METAL BASE WIRING BOARD, AND LED LIGHT SOURCE MEMBER
(FR) FEUILLE DE COMPOSITION DE RÉSINE SUR LAQUELLE UNE FEUILLE MÉTALLIQUE EST FIXÉE, MATÉRIAU DE CARTE DE CIRCUITS IMPRIMÉS À BASE MÉTALLIQUE, CARTE DE CIRCUITS IMPRIMÉS À BASE MÉTALLIQUE ET ÉLÉMENT DE SOURCE DE LUMIÈRE DEL
(JA) 樹脂組成物シート、金属箔付樹脂組成物シート、メタルベース配線板材料、メタルベース配線板、及びLED光源部材
Abstract: front page image
(EN)A resin composition sheet of the present invention is formed from a resin composition comprising a thermosetting resin, phenolic resin, and insulating inorganic filler. The occupancy percentage of recesses having a maximum depth of 0.5 μm or more in the surface of the resin composition sheet is 4% or less by area percentage.
(FR)L'invention concerne une feuille de composition de résine formée d'une composition de résine comprenant une résine thermodurcissable, une résine phénolique et une charge inorganique isolante. Le pourcentage d'occupation des évidements ménagés dans la feuille de composition de résine présentant une profondeur maximum de 0,5 μm ou plus est de 4% ou moins en pourcentage de surface.
(JA) 本発明の樹脂組成物シートは、熱硬化性樹脂と、フェノール樹脂と、絶縁性無機フィラーとを含む樹脂組成物から形成され、表面における、最大深さ0.5μm以上の凹部の占有率が、面積率で4%以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)