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1. (WO2012102098) PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/102098    International Application No.:    PCT/JP2012/050598
Publication Date: 02.08.2012 International Filing Date: 13.01.2012
IPC:
C23C 18/31 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; 3-1, Akasaka 5-chome, Minato-ku, Tokyo 1076325 (JP) (For All Designated States Except US).
TANAKA Takashi [JP/JP]; (JP) (For US Only).
SAITO Yusuke [JP/JP]; (JP) (For US Only).
IWASHITA Mitsuaki [JP/JP]; (JP) (For US Only).
TOSHIMA Takayuki [JP/JP]; (JP) (For US Only)
Inventors: TANAKA Takashi; (JP).
SAITO Yusuke; (JP).
IWASHITA Mitsuaki; (JP).
TOSHIMA Takayuki; (JP)
Agent: KATSUNUMA Hirohito; Kyowa Patent & Law Office, Room 323, Fuji Bldg., 2-3, Marunouchi 3-chome, Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2011-013465 25.01.2011 JP
Title (EN) PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM
(FR) DISPOSITIF AINSI QUE PROCÉDÉ DE TRAITEMENT DE PLACAGE, ET SUPPORT DE MÉMOIRE
(JA) めっき処理装置、めっき処理方法および記憶媒体
Abstract: front page image
(EN)[Problem] To supply a plating apparatus in which dissolved oxygen and dissolved hydrogen are efficiently removed from a plating solution. [Solution] A plating apparatus (20) comprises a substrate rotating/holding mechanism (110) that rotatably holds a substrate (2), and a plating solution supply mechanism (30) that supplies a plating solution (35) to the substrate (2). The plating solution supply mechanism (30) has: a supply tank (31) that stores the plating solution (35) to be supplied to the substrate (2); a discharge nozzle (32) that discharges the plating solution (35) to the substrate (2); and a plating solution supply pipe (33) that supplies the plating solution (35) from the supply tank (31) to the discharge nozzle (32). In addition, a supply tank degasification means (34) that is connected to the supply tank (31) and removes dissolved oxygen and dissolved hydrogen from the plating solution (35) stored in the supply tank (31) is disposed in the supply tank (31).
(FR)L'invention concerne un dispositif de traitement de placage dans lequel un oxygène dissous et un hydrogène dissous sont retirés efficacement d'une solution de placage. Ce dispositif de traitement de placage (20) est équipé : d'un mécanisme de support rotatif de substrat (110) qui met en rotation et supporte un substrat (2); et d'un mécanisme d'alimentation en solution de placage (30) qui alimente le substrat (2) en solution de placage (35). Ce mécanisme d'alimentation en solution de placage (30) possède : un réservoir d'alimentation (31) dans lequel est stockée la solution de placage (35) destinée à l'alimentation du substrat (2); une buse de décharge (32) qui décharge la solution de placage (35) sur le substrat (2); et un tuyau d'alimentation de solution de placage (33) qui alimente la buse de décharge (32) en solution de placage (35) provenant du réservoir d'alimentation (31). En outre, un moyen de désaération pour réservoir d'alimentation (34) qui est connecté au réservoir d'alimentation (31), et qui retire l'oxygène dissous et l'hydrogène dissous de la solution de placage (35) stockée dans le réservoir d'alimentation (31), est agencé au niveau du réservoir d'alimentation (31).
(JA)[課題]めっき液中の溶存酸素および溶存水素が効率的に除去されるめっき処理装置を提供する。 [解決手段]めっき処理装置20は、基板2を回転保持する基板回転保持機構110と、基板2にめっき液35を供給するめっき液供給機構30と、を備えている。このうちめっき液供給機構30は、基板2に供給されるめっき液35を貯留する供給タンク31と、めっき液35を基板2に吐出する吐出ノズル32と、供給タンク31のめっき液35を吐出ノズル32へ供給するめっき液供給管33と、を有している。また供給タンク31には、供給タンク31に接続され、供給タンク31に貯留されためっき液35中の溶存酸素および溶存水素を除去する供給タンク用脱気手段34が設けられている。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)