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1. (WO2012102080) SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/102080    International Application No.:    PCT/JP2012/050376
Publication Date: 02.08.2012 International Filing Date: 11.01.2012
IPC:
H01L 31/04 (2006.01), H01L 31/042 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP) (For All Designated States Except US).
MOMOZAKI Aya [JP/JP]; (JP) (For US Only).
KATOGI Shigeki [JP/JP]; (JP) (For US Only).
HAYASHI Hiroki [JP/JP]; (JP) (For US Only).
NATORI Michiko [JP/JP]; (JP) (For US Only).
SUKATA Shinichirou [JP/JP]; (JP) (For US Only)
Inventors: MOMOZAKI Aya; (JP).
KATOGI Shigeki; (JP).
HAYASHI Hiroki; (JP).
NATORI Michiko; (JP).
SUKATA Shinichirou; (JP)
Agent: HASEGAWA Yoshiki; SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA (Meiji Yasuda Life Bldg.) 9th fl., 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2011-015631 27.01.2011 JP
Title (EN) SOLAR CELL MODULE AND METHOD OF MANUFACTURING THEREOF
(FR) MODULE DE PHOTOPILE ET SON PROCÉDÉ DE FABRICATION
(JA) 太陽電池モジュール及びその製造方法
Abstract: front page image
(EN)A method of manufacturing a solar cell module of the present invention is provided with: (A) a process for applying a conductive adhesive composition containing conductive particles (a) comprising metals onto electrodes of solar cells; (B) a process for arranging wiring members so as to be opposed to the electrodes of the solar cells, with the applied conductive adhesive composition interposed therebetween; (C) a process for heating the solar cells with the wiring members attached thereto obtained in the (B) process; and (D) a process for laminating sealing layers on both faces of the solar cells with the wiring members attached thereto obtained in the (C) process, laminating protection glasses onto the light receiving faces of the solar cells, laminating protection films onto the back faces of the solar cells, and heating the solar cells. The melting point of the metals within the conductive particles (a) is to be not higher than the heating temperature in process (C).
(FR)La présente invention concerne un procédé de fabrication d'un module de photopile comprenant : (A) un processus d'application d'une composition adhésive conductrice contenant des particules conductrices (a) comprenant des métaux sur des électrodes de photopiles; (B) un processus de disposition d'éléments de câblage de manière à ce qu'ils soient opposés aux électrodes des photopiles, la composition adhésive conductrice appliquée étant interposée entre ceux-ci; (C) un processus de chauffage des photopiles, les éléments de câblage obtenus au cours du processus (B) étant fixés à celles-ci; et (D) un processus de stratification des couches d'étanchéité sur les deux faces des photopiles, les éléments de câblage obtenus au cours du processus (C) étant fixés à celles-ci, la stratification de verres de protection sur les faces de réception de lumière des photopiles, la stratification des films de protection sur les faces arrière des photopiles et le chauffage des photopiles. Le point de fusion des métaux dans les particules conductrices (a) ne doit pas être supérieur à la température de chauffage au cours du processus (C).
(JA) 本発明の太陽電池モジュールの製造方法は、(A)太陽電池セルの電極上に(a)金属を含む導電性粒子等を含有する導電性接着剤組成物を塗布する工程、(B)塗布された導電性接着剤組成物を挟んで、太陽電池セルの電極と相対向するように配線部材を配置する工程、(C)(B)工程で得られた配線部材付太陽電池セルを加熱する工程、(D)(C)工程で得られた配線部材付太陽電池セルの両面に封止樹脂を積層し、さらに太陽電池セルの受光面に保護ガラスを、太陽電池セルの裏面に保護フィルムを積層して加熱する工程を備える太陽電池モジュールの製造方法であって、(a)導電性粒子における金属の融点が(C)工程における加熱温度以下である。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)