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1. (WO2012102076) CONDUCTIVE BINDER COMPOSITION, METAL WIRE WITH CONDUCTIVE BINDER, BONDED UNIT, AND SOLAR CELL MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/102076    International Application No.:    PCT/JP2012/050361
Publication Date: 02.08.2012 International Filing Date: 11.01.2012
IPC:
C09J 163/00 (2006.01), C09J 9/02 (2006.01), C09J 11/04 (2006.01), C09J 11/06 (2006.01), H01B 1/22 (2006.01), H01L 31/042 (2006.01)
Applicants: HITACHI CHEMICAL COMPANY, LTD. [JP/JP]; 9-2, Marunouchi 1-chome, Chiyoda-ku, Tokyo 1006606 (JP) (For All Designated States Except US).
YOKOCHI Seigo [JP/JP]; (JP) (For US Only).
FUJITA Masaru [JP/JP]; (JP) (For US Only).
HAYASHI Hiroki [JP/JP]; (JP) (For US Only)
Inventors: YOKOCHI Seigo; (JP).
FUJITA Masaru; (JP).
HAYASHI Hiroki; (JP)
Agent: HASEGAWA Yoshiki; SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA (Meiji Yasuda Life Bldg.) 9th fl., 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2011-015624 27.01.2011 JP
Title (EN) CONDUCTIVE BINDER COMPOSITION, METAL WIRE WITH CONDUCTIVE BINDER, BONDED UNIT, AND SOLAR CELL MODULE
(FR) COMPOSITION LIANTE CONDUCTRICE, FIL MÉTALLIQUE AVEC LIANT CONDUCTEUR, UNITÉ LIÉE, ET MODULE DE CELLULE SOLAIRE
(JA) 導電性接着剤組成物、導電性接着剤付金属導線、接続体及び太陽電池モジュール
Abstract: front page image
(EN)The conductive binder composition of this invention comprises (A) conductive particles containing a metal having a melting point of 210ºC or lower, (B) a resin that is a solid at normal temperature and that has a softening point that is no higher than the melting point of the metal in the conductive particles, (C) a flux activator, and (D) a solvent. 
(FR)La composition liante conductrice selon l'invention comprend (A) des particules conductrices contenant un métal ayant un point de fusion de 210ºC ou moins, (B) une résine qui est solide à température ambiante et a un point de ramollissement qui n'est pas supérieur au point de fusion du métal contenu dans les particules conductrices, (C) un activateur de flux, et (D) un solvant. 
(JA) 本発明の導電性接着剤組成物は、(A)融点が210℃以下である金属を含む導電性粒子、(B)軟化点が該導電性粒子における金属の融点以下であり、かつ常温で固体である樹脂、(C)フラックス活性剤、及び(D)溶媒を含む。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)