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1. (WO2012101988) HEAT-CONDUCTIVE FILM AND PRODUCTION METHOD THEREFOR
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/101988    International Application No.:    PCT/JP2012/000285
Publication Date: 02.08.2012 International Filing Date: 18.01.2012
IPC:
C08J 5/18 (2006.01), C08J 3/20 (2006.01), C08K 3/38 (2006.01), C08L 79/08 (2006.01), C08L 101/00 (2006.01)
Applicants: NITTO DENKO CORPORATION [JP/JP]; 1-2, Shimohozumi 1-chome, Ibaraki-shi, Osaka 5678680 (JP) (For All Designated States Except US).
TAKAYAMA, Yoshinari [JP/JP]; (JP) (For US Only).
TAGAWA, Kenichi [JP/JP]; (JP) (For US Only).
KITAGAWA, Daisuke [JP/JP]; (JP) (For US Only).
TAKAHASHI, Tatsuhiro [JP/JP]; (JP) (For US Only).
YONETAKE, Koichiro [JP/JP]; (JP) (For US Only).
AWANO, Hiroshi [JP/JP]; (JP) (For US Only).
SHOJI, Takumi [JP/JP]; (JP) (For US Only).
TADA, Mitsuteru [JP/JP]; (JP) (For US Only)
Inventors: TAKAYAMA, Yoshinari; (JP).
TAGAWA, Kenichi; (JP).
KITAGAWA, Daisuke; (JP).
TAKAHASHI, Tatsuhiro; (JP).
YONETAKE, Koichiro; (JP).
AWANO, Hiroshi; (JP).
SHOJI, Takumi; (JP).
TADA, Mitsuteru; (JP)
Agent: KAMADA, Koichi; 8th Fl., UMEDA PLAZA BLDG. ANNEX, 4-3-25, Nishitenma, Kita-ku, Osaka-shi, Osaka 5300047 (JP)
Priority Data:
2011-016095 28.01.2011 JP
Title (EN) HEAT-CONDUCTIVE FILM AND PRODUCTION METHOD THEREFOR
(FR) FILM THERMOCONDUCTEUR ET SON PROCÉDÉ DE PRODUCTION
(JA) 熱伝導性フィルム及びその製造方法
Abstract: front page image
(EN)A heat-conductive film (10) comprises: a substrate (12) composed of resin; and a scaly filler (14) dispersed in the substrate (12). The scaly filler (14) contains a scaly filler body (16) composed of boron nitride and a coat of γ-ferrite (18) coating the filler body (16), and orients in the thickness direction of the heat-conductive film (10). The resin is, for example, polyimide.
(FR)Film thermoconducteur (10) comprenant : un substrat (12) à base de résine ; et une charge en feuillet (14) dispersée dans le substrat (12). La charge en feuillet (14) contient un corps de charge en feuillet (16) constitué de nitrure de bore et d'un revêtement de γ-ferrite (18) recouvrant ledit corps de charge (16), et s'oriente dans le sens de l'épaisseur du film thermoconducteur (10). La résine est, par exemple, un polyimide.
(JA) 熱伝導性フィルム10は、樹脂で構成された基質12と、基質12中に分散している鱗片状のフィラー14と、を備えている。鱗片状のフィラー14は、窒化ホウ素で構成された鱗片状のフィラー本体16と、フィラー本体16を被覆しているγ-フェライトの被膜18とを有し、当該熱伝導性フィルム10の厚さ方向に配向している。樹脂は、例えば、ポリイミドである。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)