WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2012101837) GRINDING/POLISHING DEVICE FOR POLYGONAL COLUMN MEMBER AND GRINDING/POLISHING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/101837    International Application No.:    PCT/JP2011/055358
Publication Date: 02.08.2012 International Filing Date: 08.03.2011
IPC:
B24B 7/16 (2006.01), B24B 7/22 (2006.01), B24B 9/00 (2006.01), B24B 29/00 (2006.01), B24D 13/14 (2006.01)
Applicants: SINTOKOGIO, LTD. [JP/JP]; 28-12, Meieki 3-chome, Nakamura-ku, Nagoya-shi, Aichi 4500002 (JP) (For All Designated States Except US).
TANAHASHI, Shigeru [JP/JP]; (JP) (For US Only).
HIRANO, Masao [JP/JP]; (JP) (For US Only).
SAWAI, Shouta [JP/JP]; (JP) (For US Only)
Inventors: TANAHASHI, Shigeru; (JP).
HIRANO, Masao; (JP).
SAWAI, Shouta; (JP)
Agent: YAMASAKI, Yukuzo; Yamasaki & Partners Hirakawacho Mori Tower 10F., 16-1, Hirakawa-cho 2-chome, Chiyoda-ku, Tokyo 1020093 (JP)
Priority Data:
2011-016416 28.01.2011 JP
Title (EN) GRINDING/POLISHING DEVICE FOR POLYGONAL COLUMN MEMBER AND GRINDING/POLISHING METHOD
(FR) DISPOSITIF DE MEULAGE/POLISSAGE POUR ÉLÉMENT EN FORME DE COLONNE POLYGONALE ET PROCÉDÉ DE MEULAGE/POLISSAGE
(JA) 多角柱状部材の研削・研磨加工装置および研削・研磨加工方法
Abstract: front page image
(EN)Provided are: a silicon block grinding/polishing device comprising a grinding function capable of grinding a square column-shaped silicon block within tolerance ranges of ±0.5 mm for the cross-section dimensions thereof and ±0.1° for the perpendicular angles thereof, said block having been formed by cutting a silicon ingot using a wire saw, and comprising a polishing function capable of removing micro cracks in the surface layer of the cut silicon block (W); and a processing method therefor. The device comprises: a holding means (1) that holds the silicon block (W); a measuring means (2) that measures the cross-section dimensions of the silicon block (W); a grinding means (3) that grinds the planar sections (F) and the angular sections (C) of the silicon block (W); a polishing means (4) that polishes the planar sections (F) and the angular sections (C) of the silicon block (W) which has completed grinding and removes micro cracks; a transfer means (5) that transfers the holding means (1) holding the silicon block (W), between the measuring means (2), the grinding means (3), and the polishing means (4); and a control means (6) that operates each of the means.
(FR)La présente invention concerne : un dispositif de meulage/polissage de bloc de silicium comprenant une fonction meulage pouvant meuler un bloc de silicium en forme de colonne carrée dans des plages de tolérance de ±0,5 mm pour ses dimensions en coupe transversale et de ±0,1° pour ses angles perpendiculaires, ledit bloc ayant été formé par la découpe d'un lingot de silicium à l'aide d'une scie à fil, et comprenant une fonction polissage pouvant enlever les microfissures dans la couche de surface du bloc de silicium (W) découpé ; et un procédé de traitement associé. Le dispositif comprend : un moyen de maintien (1) qui maintient le bloc de silicium (W) ; un moyen de mesure (2) qui mesure les dimensions en coupe transversale du bloc de silicium (W) ; un moyen de meulage (3) qui meule les sections planes (F) et les sections angulaires (C) du bloc de silicium (W) ; un moyen de polissage (4) qui polit les sections planes (F) et les sections angulaires (C) du bloc de silicium (W) dont le meulage est terminé et qui enlève les microfissures ; un moyen de transfert (5) qui transfère le moyen de maintien (1) maintenant le bloc de silicium (W), entre le moyen de mesure (2), le moyen de meulage (3) et le moyen de polissage (4) ; et un moyen de commande (6) qui actionne chacun des moyens.
(JA) シリコンインゴットをワイヤソーで切断形成された四角柱状のシリコンブロックの断面寸法を±0.5mm、その角部の直角度を±0.1度、の公差範囲内に加工できる研削機能と、切断形成されたシリコンブロック(W)の表層のマイクロクラックを除去することができる研磨機能を備えたシリコンブロックの研削・研磨加工装置とその加工方法を提供すること。 シリコンブロック(W)を把持する把持手段(1)と、前記シリコンブロック(W)の断面寸法を計測する計測手段(2)と、前記シリコンブロック(W)の平面部(F)および角部(C)を研削する研削手段(3)と、前記研削加工を終了したシリコンブロック(W)の平面部(F)および角部(C)を研磨してマイクロクラックを除去する研磨手段(4)と、シリコンブロック(W)を把持した前記把持手段(1)を計測手段(2)、研削手段(3)、研磨手段(4)の間を移送させる移送手段(5)と、前記各手段を作動させる制御手段(6)を備える。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)