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1. (WO2012099713) HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/099713    International Application No.:    PCT/US2012/020129
Publication Date: 26.07.2012 International Filing Date: 04.01.2012
IPC:
C08G 59/00 (2006.01), C08G 59/06 (2006.01), C08G 59/40 (2006.01)
Applicants: DOW GLOBAL TECHNOLOGIES LLC [US/US]; 2040 Dow Center Midland, MI 48674 (US) (For All Designated States Except US).
WILSON, Mark B. [US/US]; (US) (For US Only).
HEARN, Robert L. [US/US]; (US) (For US Only)
Inventors: WILSON, Mark B.; (US).
HEARN, Robert L.; (US)
Agent: WELVAERT, Bronwyn; The Dow Chemical Company Intellectual Property P.O. Box 1967 Midland, Michigan 48641 (US)
Priority Data:
61/434,881 21.01.2011 US
Title (EN) HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS
(FR) MATIÈRE PLASTIQUE THERMODURCISSABLE À HAUTE PERFORMANCE UTILE POUR UN STRATIFIÉ ÉLECTRIQUE, INTERCONNECTEUR À HAUTE DENSITÉ ET APPLICATIONS DE SUBSTRAT INTERCONNECTEUR
Abstract: front page image
(EN)A composition comprising, consisting of, or consisting essentially of: a) tetraphenolic epoxy resin; b) a maleimide; and c) a triazine and/or a cyanate ester is disclosed. Also disclosed is a process for making the composition and its end-uses, such as in electrical laminates and composites.
(FR)L'invention concerne une composition comprenant, consistant en ou consistant essentiellement en : a) une résine époxy tétraphénolique ; b) un maléimide ; et c) une triazine et/ou un ester de cyanate. L'invention concerne également un procédé de fabrication de la composition et ses utilisations finales, telles que dans des stratifiés électriques et des composites électriques.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)