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1. (WO2012099290) METHOD FOR MANUFACTURING BOTH-FACE COPPER-CLAD LAMINATE SUBSTRATE USING CASTING AND SPUTTERING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/099290    International Application No.:    PCT/KR2011/000561
Publication Date: 26.07.2012 International Filing Date: 27.01.2011
IPC:
C23C 14/34 (2006.01), H05K 1/09 (2006.01)
Applicants: SD FLEX CO., LTD. [KR/KR]; 290 Gongdan-dong Gumi-si, Gyeongsangbuk-do 730-030 (KR) (For All Designated States Except US).
LEE, Sang-Rak [KR/KR]; (KR) (For US Only).
CHO, Dong-Joon [KR/KR]; (KR) (For US Only).
KWON, Hyun-Woo [KR/KR]; (KR) (For US Only).
KIM, Young-Ju [KR/KR]; (KR) (For US Only).
JUNG, Yon-Joong [KR/KR]; (KR) (For US Only).
PARK, Sang-Hyun [KR/KR]; (KR) (For US Only)
Inventors: LEE, Sang-Rak; (KR).
CHO, Dong-Joon; (KR).
KWON, Hyun-Woo; (KR).
KIM, Young-Ju; (KR).
JUNG, Yon-Joong; (KR).
PARK, Sang-Hyun; (KR)
Agent: DAE-A INTELLECTUAL PROPERTY CONSULTING; 3F & 4F, Hanyang Bldg. 123 Yeoksam-ro, Gangnam-gu Seoul 135-936 (KR)
Priority Data:
10-2011-0006027 20.01.2011 KR
Title (EN) METHOD FOR MANUFACTURING BOTH-FACE COPPER-CLAD LAMINATE SUBSTRATE USING CASTING AND SPUTTERING
(FR) PROCÉDÉ POUR LA FABRICATION D'UN SUBSTRAT DE STRATIFIÉ CUIVRÉ SUR LES DEUX FACES UTILISANT LE MOULAGE ET LA PULVÉRISATION CATHODIQUE
(KO) 캐스팅 및 스퍼터링을 이용한 양면동박적층기판 제조 방법
Abstract: front page image
(EN)The present invention relates to a method for manufacturing a both-face copper-clad laminate substrate, wherein a copper film formed on one surface of a copper-clad laminate substrate is formed using a casting step, and a copper film formed on the other surface thereof is formed by the formation of a Ni/Cr seed layer and a Cu sputtering layer by using a sputtering and a Cu plating step, thereby improving the adhesion of the copper films, and making it possible to easily manufacture a thin copper-clad laminate substrate.
(FR)La présente invention porte sur un procédé pour la fabrication d'un substrat de stratifié cuivré sur les deux faces, une couche de cuivre formée sur une surface d'un substrat de stratifié cuivré étant formée à l'aide d'une étape de moulage et une couche de cuivre formée sur l'autre surface de celui-ci étant formée par la formation d'une couche de germe de Ni/Cr et d'une couche de pulvérisation cathodique de Cu à l'aide d'une étape de pulvérisation cathodique et d'une étape de cuivrage, ce qui de cette manière améliore l'adhérence des couches de cuivre et permet de fabriquer facilement un substrat de stratifié cuivré mince.
(KO)본 발명은 양면동박적층기판 제조 방법에 관한 것으로, 동박적층기판의 일면에 형성되는 동박은 캐스팅(Casting) 공정을 이용하여 형성하고, 타면에 형성되는 동박은 스퍼터링(Sputtering)을 이용한 Ni/Cr 시드층 및 Cu 스퍼터링층 형성 및 Cu 도금(Plating) 공정을 이용하여 형성함으로써, 동박의 접착력을 향상시키고, 얇은 두께의 동박적층기판을 용이하게 제조할 수 있도록 하는 발명에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)