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Machine translation
1. (WO2012096354) HIGH-FREQUENCY MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/096354    International Application No.:    PCT/JP2012/050524
Publication Date: 19.07.2012 International Filing Date: 12.01.2012
IPC:
H04B 1/08 (2006.01)
Applicants: MITSUMI ELECTRIC CO., LTD. [JP/JP]; 2-11-2, Tsurumaki, Tama-Shi, Tokyo 2068567 (JP) (For All Designated States Except US).
MACHIDA, Yuji [JP/JP]; (JP) (For US Only)
Inventors: MACHIDA, Yuji; (JP)
Agent: ITOH, Tadahiko; 16th Floor, Marunouchi MY PLAZA (Meiji Yasuda Seimei Building), 1-1, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1000005 (JP)
Priority Data:
2011-006314 14.01.2011 JP
Title (EN) HIGH-FREQUENCY MODULE
(FR) MODULE HAUTE FRÉQUENCE
(JA) 高周波モジュール
Abstract: front page image
(EN)Provided is a high-frequency module having a component mounted on one surface of a substrate, an electrode for connecting the component mounted on the one surface to a device on which the high-frequency module is to be mounted, and a first insulation layer formed on the one surface so as to cover the component, wherein the electrode is formed so that at least part thereof is continuous to the surface of the first insulation layer.
(FR)L'invention concerne un module haute fréquence qui comprend: un composant monté sur une surface d'un substrat; une électrode pour raccorder ledit composant à un dispositif sur lequel le module haute fréquence doit être installé; et une première couche isolante formée sur ladite surface de façon à couvrir le composant, l'électrode étant formée de sorte qu'au moins une partie de celle-ci prolonge la surface de la première couche isolante.
(JA) 基板の一方の面に実装された部品と、前記一方の面に形成された前記部品と当該高周波モジュールを搭載する装置とを接続するための電極と、前記一方の面に前記部品を覆うように形成された第1絶縁層と、を有する高周波モジュールであって、前記電極は、少なくとも前記電極の一部が前記第1絶縁層の表面で前記第1絶縁層と連続するように形成されている高周波モジュールを提供する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)