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Machine translation
1. (WO2012095757) REVERSIBLY ADHESIVE THERMAL INTERFACE MATERIAL
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2012/095757    International Application No.:    PCT/IB2012/050035
Publication Date: 19.07.2012 International Filing Date: 04.01.2012
IPC:
H01L 23/40 (2006.01), H01L 23/373 (2006.01), H05K 7/20 (2006.01), C08L 83/04 (2006.01)
Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION [US/US]; New Orchard Road Armonk, New York 10504 (US) (For All Designated States Except US).
IBM UNITED KINGDOM LIMITED [GB/GB]; PO Box 41, North Harbour Portsmouth Hampshire PO6 3AU (GB) (MG only).
IBM (China) Investment Company Limited [CN/CN]; 25/F, Pangu Plaza No.27, Central North 4th Ring Road, Chaoyang District, Beijing 100101 (CN) (MG only).
BODAY, Dylan [US/US]; (US) (For US Only).
KUCZYNSKI, Joseph [US/US]; (US) (For US Only).
MEYER III, Robert [US/US]; (US) (For US Only)
Inventors: BODAY, Dylan; (US).
KUCZYNSKI, Joseph; (US).
MEYER III, Robert; (US)
Agent: GASCOYNE, Belinda; IBM United Kingdom Limited Intellectual Property Law Hursley Park Winchester Hampshire SO21 2JN (GB)
Priority Data:
13/006,602 14.01.2011 US
Title (EN) REVERSIBLY ADHESIVE THERMAL INTERFACE MATERIAL
(FR) MATÉRIAU D'INTERFACE THERMIQUE ADHÉSIF DE FAÇON RÉVERSIBLE
Abstract: front page image
(EN)The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally- reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9 x 1011 ohm-cm or more.
(FR)La présente invention porte sur un matériau d'interface thermique adhésif de façon réversible pour des composants électroniques et sur ses procédés de réalisation et d'utilisation. Plus particulièrement, des modes de réalisation de l'invention portent sur des matériaux d'interface thermique qui comprennent un adhésif thermiquement réversible, et une charge thermoconductrice et électriquement non conductrice, le matériau d'interface thermique étant caractérisé par une conductivité thermique de 0,2 W/m-K ou plus et une résistivité électrique de 9 x 1011 ohm-cm ou plus.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)