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Pub. No.: WO/2012/095223 International Application No.: PCT/EP2011/072030
Publication Date: 19.07.2012 International Filing Date: 07.12.2011
Chapter 2 Demand Filed: 06.11.2012
B29C 51/42 (2006.01) ,B29C 51/08 (2006.01) ,B65B 29/02 (2006.01)
Applicants: WOODWARD, Adrian, Michael[GB/GB]; GB (UsOnly)
UNILEVER PLC[GB/GB]; Unilever House 100 Victoria Embankment London Greater London EC4Y 0DY, GB (AE, AG, AU, BB, BH, BW, BZ, CA, CY, EG, GB, GD, GH, GM, IE, IL, KE, KN, LC, LK, LS, MT, MW, MY, NA, NG, NZ, OM, PG, QA, RW, SC, SD, SG, SL, SZ, TT, TZ, UG, VC, ZA, ZM, ZW)
UNILEVER N.V.[NL/NL]; Weena 455 NL-3013 AL Rotterdam, NL (AL, AM, AO, AT, AZ, BA, BE, BF, BG, BJ, BR, BY, CF, CG, CH, CI, CL, CM, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, ES, FI, FR, GA, GE, GN, GQ, GR, GT, GW, HN, HR, HU, ID, IS, IT, JP, KG, KM, KP, KR, KZ, LA, LR, LT, LU, LV, LY, MA, MC, MD, ME, MG, MK, ML, MN, MR, MX, MZ, NE, NI, NL, NO, PE, PH, PL, PT, RO, RS, RU, SE, SI, SK, SM, SN, ST, SV, SY, TD, TG, TH, TJ, TM, TN, TR, UA, UZ, VN)
HINDUSTAN UNILEVER LIMITED[IN/IN]; Unilever House B.D. Sawant Marg Chakala, Andheri East Maharashtra Mumbai 400 099, IN (IN)
Inventors: WOODWARD, Adrian, Michael; GB
Agent: CLARKE, Christopher, John; Unilever PLC Unilever Patent Group Colworth House, Sharnbrook Bedford Bedfordshire MK44 1LQ, GB
Priority Data:
Abstract: front page image
(EN) Provided is a process for thermoforming a gas and liquid permeable layer (10) of thermoplastic material having an average thickness of less than 1.0 mm, the process comprising the steps of bringing the layer of thermoplastic material, at a temperature below that required for thermoforming, into contact with a mould (16) at a temperature above that of a thermoforming temperature of the thermoplastic material; pressing the mould into contact with the layer of thermoplastic material, the contact between mould and thermoplastic material causing heat to transfer from the mould to the thermoplastic material and raising the temperature of the thermoplastic material to a thermoformable temperature; such pressing thereby causing thermoforming of the thermoplastic material to conform to the shape of the mould.
(FR) La présente invention concerne un procédé pour thermoformer une couche perméable aux gaz et aux liquides (10) de matériau thermoplastique ayant une épaisseur moyenne de moins de 1,0 mm, le procédé comprenant les étapes consistant à amener la couche de matériau thermoplastique, à une température au-dessous de celle requise pour thermoformage, en contact avec un moule (16) à une température au-dessus de celle d'une température de thermoformage du matériau thermoplastique ; presser le moule en contact avec la couche de matériau thermoplastique, le contact entre le moule et le matériau thermoplastique amenant de la chaleur à être transférée du moule vers le matériau thermoplastique, et élever la température du matériau thermoplastique à une température thermoformable ; un tel pressage amenant ainsi le thermoformage du matériau thermoplastique à se conformer à la forme du moule.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Office (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (EPO) (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)